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3D gel printing of graded TiC-high manganese steel cermet

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Abstract

A new solid freeform process, 3D gel printing (3DGP), was proposed for designing and manufacturing graded composites. As an example, TiC-high manganese steel cermet with a gradient distribution of TiC was successfully designed and fabricated by 3DGP. The rheological behavior and polymerization of slurries with different TiC content have been researched. The complex-shaped green bodies were printed accurately by depositing slurries layer by layer. The scanning electron microscopy and X-ray diffraction revealed the gradient distribution and morphology of the TiC particles within a sintered sample. The density, hardness, abrasion wear resistance, transverse rupture strength and impact toughness of the 3D gel-printed TiC-high manganese steel cermet appeared graded distribution corresponding to its gradient structure. Gradient distribution of the composition, microstructure and mechanical properties of the 3D gel-printed part are consistent with the design concept. Results indicated that 3DGP is a promising approach for high-throughput design and fabrication of complex-shaped graded composites.

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Acknowledgements

This work was supported by the Fundamental Research Funds for the Central Universities (No. FRF-TP-16-017A1) and the State Key Lab of Advanced Metals and Materials (No. 2016-ZD02).

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Authors and Affiliations

  1. Institute for Advanced Materials and Technology, University of Science and Technology Beijing, Beijing, 100083, China

    Xinyue Zhang, Fang Yang & Zhimeng Guo

  2. School of Engineering Technology, Purdue University, West Lafayette, IN, 47907, USA

    Leichen Guo

  3. Department of Mechanical Engineering, University of South Florida, Tampa, FL, 33620, USA

    Alex A. Volinsky & Megan Hostetter

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  1. Xinyue Zhang
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  2. Leichen Guo
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  3. Fang Yang
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  4. Alex A. Volinsky
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  6. Zhimeng Guo
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Correspondence to Fang Yang or Zhimeng Guo.

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Zhang, X., Guo, L., Yang, F. et al. 3D gel printing of graded TiC-high manganese steel cermet. J Mater Sci 54, 2122–2132 (2019). https://doi.org/10.1007/s10853-018-2945-5

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  • DOI: https://doi.org/10.1007/s10853-018-2945-5

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