Journal of Materials Science

, Volume 53, Issue 12, pp 8855–8865 | Cite as

Graphene/PANI hybrid film with enhanced thermal conductivity by in situ polymerization

  • Jie Miao
  • Haoliang Li
  • Hanxun Qiu
  • Xian Wu
  • Junhe Yang
Chemical routes to materials
  • 51 Downloads

Abstract

Heat dissipation in time is essential for long-term reliability of electrical devices. Graphene, with superior thermal conductivity and excellent flexibility, exhibits a potential to substitute currently used graphite film for thermal management. In this work, a free-standing film with enhanced thermal conductivity and better flexibility was achieved by a facile and environmentally friendly in situ polymerization. The ‘molecular welding’ strategy was introduced for preparation of graphitized graphene oxide/polyaniline (gGO/PANI) hybrid film, and the uniformly distributed PANI, serving as a solder, connected adjacent graphene sheets and filled in air voids of GO films. Scanning electron microscopy, Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, X-ray diffraction and Raman spectroscopy were used to determine the structure of PANI and the interaction between GO and PANI. The in-plane thermal conductivity of gGO/PANI film is enhanced by 38% to 1019.7 ± 0.1 W m−1 K−1 with addition of 12 wt% PANI, compared with that of pristine gGO film. Besides, the gGO/PANI film shows better flexibility than gGO film after 180° bending for 500 times.

Notes

Acknowledgements

The authors are thankful to National Natural Science Foundation of China (51472160, E020603), Science and Technology Commission of Shanghai Municipality (15JC-1490700, 16JC1402200) and Shanghai Municipal Commission of Economy and Information Technology for their financial supports to this work.

Supplementary material

10853_2018_2112_MOESM1_ESM.docx (1.5 mb)
Supplementary material 1 (DOCX 1509 kb)

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Copyright information

© Springer Science+Business Media, LLC, part of Springer Nature 2018

Authors and Affiliations

  1. 1.School of Material Science and EngineeringUniversity of Shanghai for Science and TechnologyShanghaiChina

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