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Journal of Materials Science

, Volume 53, Issue 8, pp 5826–5844 | Cite as

Si nanospring films for compliant interfaces

  • Dimitrios A. Antartis
  • Ryan N. Mott
  • Ioannis Chasiotis
Interface Behavior

Abstract

Films comprised of dense arrays of Si nanosprings were studied for their potential as compliant interface layers. The films, fabricated via glancing angle deposition (GLAD), were comprised of 10-µm high Si nanosprings with 4 or 10 coil turns and seed spacings of 900 nm or 1500 nm. Unseeded films with the same height and 4 or 10 coil turns were co-fabricated as the control material. The film mechanical behavior was a combination of the mechanical response of the individual springs and their interactions inside the film, resulting in increasing compressive stiffness with applied stress. The shear stiffness of all types of Si spring films was in the narrow range of 17–27 MPa. On the contrary, depending on coil geometry, the low-stress compressive stiffness could be varied in the broad range of 13–150 MPa. Thus, this class of nanostructured films allows for relatively decoupled normal and shear properties with values comparable to those of soft polymers. Despite that unseeded films have the thinnest coil wire, it was shown that seeding can produce equal or lower film stiffness, while also increasing the resistance to permanent compression at high stresses. Similarly, a capping layer increased the coherency of the films and their resistance to permanent compression without affecting significantly the compressive film stiffness. Capped films with 10-turn coils, with 900-nm seed spacing, provided the most resistance to permanent compression for stresses at least as high as 15 MPa, while maintaining compressive stiffness values that were equivalent to unseeded 10-turn springs. Finally, capped 4-turn springs with 900-nm seed spacing were shown to be the most compliant of all film types, including unseeded films, while also exhibiting the best agreement between film-level stiffness and estimates based on individual spring properties. Therefore, seeding of GLAD springs can produce films with increased resistance to permanent deformation while maintaining the low stiffness of unseeded films.

Notes

Acknowledgements

The authors acknowledge the support by the Air Force Office of Scientific Research (AFOSR) through Grants FA9550-13-1-0149 and FA9550-15-1-0470 with Dr. B.L. Lee as the program manager. We also wish to thank Prof. M. Brett from the University of Alberta for his input on the fabrication of the GLAD films.

References

  1. 1.
    Shaddock D, Weaver S, Chasiotis I, Shah B, Zhong D (2011) Development of a compliant nanothermal interface material. In: Proceedings of ASME 2011, pp. 1–5Google Scholar
  2. 2.
    Antartis DA, Mott RN, Shaddock D and Chasiotis I (2017) Advanced thermal interfaces of nanospring films, in reviewGoogle Scholar
  3. 3.
    Bar-Cohen A, Matin K, Narumanchi S (2015) Nanothermal interface materials: technology review and recent results. J Electron Packag 137:040803-1–040803-17Google Scholar
  4. 4.
    Antartis D, Chasiotis I (2014) Residual stress and mechanical property measurements in amorphous si photovoltaic thin films. Sol Energy 105:694–704CrossRefGoogle Scholar
  5. 5.
    Polat BD, Eryilmaz OL, Erck R, Keles O, Erdemir A, Amine K (2014) Structured SiCu thin films in LiB as anodes. Thin Solid Films 572:134–141CrossRefGoogle Scholar
  6. 6.
    Polat BD, Keles O, Amine K (2015) Silicon-copper helical arrays for new generation lithium ion batteries. Nano Lett 15:6702–6708CrossRefGoogle Scholar
  7. 7.
    Polat BD, Keles O, Amine K (2016) Compositionally-graded silicon-copper helical arrays as anodes for lithium-ion batteries. J Power Sources 304:273–281CrossRefGoogle Scholar
  8. 8.
    Polat BD, Keles O (2016) Designing self-standing silicon-copper composite helices as anodes for lithium ion batteries. J Alloys Compd 677:228–236CrossRefGoogle Scholar
  9. 9.
    Kharisov BI, Krarissova OV, Garcia BO, Méndez YP, Gómez de la Fuente I (2015) State of the art of nanoforest structures and their applications. RSC Adv 5:105507–105523CrossRefGoogle Scholar
  10. 10.
    Qu L, Dai L, Stone M, Xia Z, Wang ZL (2008) Carbon nanotube arrays with strong shear binding-on and easy normal lifting-off. Science 322:238–242CrossRefGoogle Scholar
  11. 11.
    Tong T, Zhao Y, Delzeit L (2007) Dense vertically aligned multiwalled carbon nanotube arrays as thermal interface materials. IEEE Trans Compon Packag Technol 30:92–100CrossRefGoogle Scholar
  12. 12.
    Ge L, Ci L, Goyal A, Shi R, Mahadevan L, Ajayan PM, Dhinojwala A (2010) Cooperative adhesion and friction of compliant nanohairs. Nano Lett 10:4509–4513CrossRefGoogle Scholar
  13. 13.
    Kumar A, Maschmann MR, Hodson SL, Baur J, Fischer TS (2015) Carbon nanotube arrays decorated with multi-layer graphene-nanopetals enhance mechanical strength and durability. Carbon 84:236–245CrossRefGoogle Scholar
  14. 14.
    Sadasivam S, Hodson SL, Maschmann MR, Fischer TS (2016) Combined microstructure and heat transfer modeling of carbon nanotube thermal interface materials. J Heat Transf 138:042402-1–042402-12CrossRefGoogle Scholar
  15. 15.
    Chen X, Zhang S, Dikin DA, Ding W, Ruoff RS, Pan L, Nakayama Y (2003) Mechanics of a carbon nanocoil. Nano Lett 3:1299–1304CrossRefGoogle Scholar
  16. 16.
    Daraio C, Nesterenko VF, Jin S, Wang W, Rao AM (2006) Impact response by a foamlike forest of coiled carbon nanotubes. J Appl Phys 100:063409-1–063409-4CrossRefGoogle Scholar
  17. 17.
    Coluci VR, Fonseca AF, Galvão DS, Daraio C (2008) Entanglement and the nonlinear behavior of forests of coiled carbon nanotubes. Phys Rev Lett 100:086807-1–086807-4CrossRefGoogle Scholar
  18. 18.
    Hawkeye M, Brett MJ (2007) Glancing angle deposition fabrication, properties, and applications of micro- and nanostructured thin films. J Vac Sci Technol A 25:1317–1335CrossRefGoogle Scholar
  19. 19.
    Taschuk MT, Hawkeye MM, Brett MJ (2010) Glancing angle deposition. In: Martin Peter M (ed) Handbook of deposition technologies for films and coatings, 3rd edn. Elsevier, MassachusettsGoogle Scholar
  20. 20.
    Zhao Y (2009) Growth and synthesis of nanostructured thin films. In: Fortin J, Zribi A (eds) Functional thin films and nanostructures for sensors. In: Potyrailo RA (ed) Integrated analytical systems, Springer, New YorkGoogle Scholar
  21. 21.
    Barranco A, Borras A, Gonzalez-Elipe AR, Palmero A (2016) Perspectives on oblique angle deposition of thin films: from fundamentals to devices. Prog Mater Sci 76:59–153CrossRefGoogle Scholar
  22. 22.
    Lintymer J, Gavoille J, Martin N, Takadoum J (2003) Glancing angle deposition to modify microstructure and properties of sputter deposited chromium thin films. Surf Coat Technol 174–175:316–323CrossRefGoogle Scholar
  23. 23.
    Lintymer J, Martin N, Chappé JM, Delobelle P, Takadoum J (2004) Influence of zigzag microstructure on mechanical and electrical properties of chromium multilayered thin films. Surf Coat Technol 180–181:26–32CrossRefGoogle Scholar
  24. 24.
    Lintymer J, Martin N, Chappé JM, Takadoum J (2008) Glancing angle deposition to control microstructure and roughness of chromium thin films. Wear 264:444–449CrossRefGoogle Scholar
  25. 25.
    Hawkeye MM, Taschuk MT, Brett MJ (eds) (2014) Chapter 5: glancing angle deposition optical films. In: Glancing angle deposition of thin films: engineering the nanoscale. Wiley, ChichesterGoogle Scholar
  26. 26.
    Merkel JJ, Sontheimer T, Rech B, Becker C (2013) Directional growth and crystallization of silicon thin films prepared by electron-beam evaporation on oblique and textured surfaces. J Cryst Growth 367:126–130CrossRefGoogle Scholar
  27. 27.
    Yu P, Chang CH, Chiu CH, Yang CS, Yu JC, Kuo HC, Hsu SH, Chang YC (2009) Efficiency enhancement of GaAs photovoltaics employing antireflective indium tin oxide nanocolumns. Adv Mater 21:1618–1621CrossRefGoogle Scholar
  28. 28.
    Yildiz A, Cansizoglu H, Turkoz M, Abdulrahman R, Al-Hilo A, Cansizoglu MF, Demirkan TM, Karabacak T (2015) Glancing angle deposited Al-doped ZnO nanostructures with different structural and optical properties. Thin Solid Films 589:764–769CrossRefGoogle Scholar
  29. 29.
    Malac M, Egerton RF, Brett MJ, Dick B (1999) Fabrication of submicrometer regular arrays of pillars and helices. J Vac Sci Technol B 17:2671–2674CrossRefGoogle Scholar
  30. 30.
    Seto MW, Robbie K, Vick D, Brett MJ, Kuhn L (1999) Mechanical response of thin films with helical microstructures. J Vac Sci Technol 17:2172–2177CrossRefGoogle Scholar
  31. 31.
    Seto MW, Dick B, Brett MJ (2001) Microsprings and microcantilevers: studies of mechanical response. J Micromech Microeng 11:582–588CrossRefGoogle Scholar
  32. 32.
    Hirakata H, Matsumoto S, Takemura M, Suzuki M, Kitamura T (2007) Anisotropic deformation of thin films comprised of helical springs. Int J Solids Struct 44:4030–4038CrossRefGoogle Scholar
  33. 33.
    Sumigawa T, Hirakata H, Takemura M, Matsumoto S, Suzuki M, Kitamura T (2008) Disappearance of stress singularity at interface edge due to nanostructured thin film. Eng Fract Mech 75:3073–3083CrossRefGoogle Scholar
  34. 34.
    Liu DL, Ye DX, Khan F, Tang F, Lim BK, Picu RC, Wang GC, Lu TM (2006) Mechanics of patterned helical Si springs on a Si substrate. J Nanosci Nanotechnol 3:492–495CrossRefGoogle Scholar
  35. 35.
    Antartis DA, Mott RN, Chasiotis I (2017) Tuning of helical nanostructures for ultra-compliant interfaces, in reviewGoogle Scholar
  36. 36.
    Jonnalagadda K, Chasiotis I, Yagnamurthy S, Lambros J, Polcawich R, Pulskamp J, Dubey M (2010) Experimental investigation of strain rate dependence in nanocrystalline Pt films. Exp Mech 50:25–35CrossRefGoogle Scholar
  37. 37.
    Naraghi M, Chasiotis I, Dzenis Y, Wen Y, Kahn H (2007) Novel method for mechanical characterization of polymeric nanofibers. Rev Sci Instrum 78:0851081–0851086CrossRefGoogle Scholar
  38. 38.
    Naraghi M, Chasiotis I (2009) Optimization of comb-driven devices for mechanical testing of polymeric nanofibers subjected to large deformations. J Microelectromech Syst 18:1032–1046CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2017

Authors and Affiliations

  • Dimitrios A. Antartis
    • 1
  • Ryan N. Mott
    • 1
  • Ioannis Chasiotis
    • 1
  1. 1.Aerospace EngineeringUniversity of Illinois at Urbana ChampaignUrbanaUSA

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