Brazing of graphite to Cu with Cu50TiH2 + C composite filler
- 344 Downloads
Brazing of graphite to Cu has been successfully realized with Cu50TiH2 (containing 50 wt% Cu)-based fillers (including Cu50TiH2 filler and Cu50TiH2 + C composite filler) in vacuum at 1223 K. The average shear strength is 10.8 MPa for the joints brazed with Cu50TiH2 filler. Microstructure observation of the joints shows the crack-free interfaces both at the graphite and the Cu sides. The filler layer mainly consists of Cu base solid solution and Ti–Cu intermetallics. Furthermore, a thin TiC reaction layer is developed close to the graphite substrate. With regard to the joints brazed with Cu50TiH2 + C composite filler, the average shear strength of the joints increases to 18.0 MPa. Microstructural characterization reveals that TiC particles have been synthesized in situ in the filler layer. Cu base solid solution and Ti–Cu intermetallics together with TiC particles are detected in the filler layer. The TiC particles synthesized in situ distribute uniformly in the filler layer, which may act as reinforcements and consequently benefit the improvement of the graphite/Cu joints.
KeywordsSelect Area Electron Diffraction Pattern Residual Thermal Stress Graphite Substrate Thermal Shock Test Filler Layer
The authors gratefully acknowledge the financial support from the National Natural Science Foundation of China (Grant No. 51304148) and the Scientific Research Project provided by Hubei Provincial Department of Education (Grant No. D20131504).
Compliance with ethical standards
Conflict of Interest
The authors declare that they have no conflict of interest.
- 10.Eustathopoulos N, Nicholas MG, Drevet B (1999) Wettability at high temperatures. Pergamon, AmsterdamGoogle Scholar
- 15.Robert J, April D, Arthur J (1997) Method for joining carbon-carbon composites to metals. Patent US/1997/5648180Google Scholar
- 18.Sobczak N, Sobczak J, Rohatgi P, Ksiazek M, Radziwill W, Morgiel J (1997) Interaction between Ti or Cr containing copper alloys and porous graphite substrate. In: Eustathopoulos N, Sobczak N (eds) Proc. 2nd Int. Conf. on High Temperature Capillarity, Cracow, Poland, pp 145–152Google Scholar
- 23.Libera S, Visca E (2006) Junction process for a ceramic material and a metallic material with the interposition of a transition material. Patent WO/2006/024971Google Scholar