Journal of Materials Science

, Volume 49, Issue 3, pp 1246–1255 | Cite as

A microscale formaldehyde gas sensor based on Zn2SnO4/SnO2 and produced by combining hydrothermal synthesis with post-synthetic heat treatment



A silicon-based micro-structure gas sensor for detecting formaldehyde was successfully fabricated and the sensing material was synthesized via a method of combining the traditional hydrothermal synthesis with subsequent heat treatment. Finite element analysis software of ANSYS was used to analyze the temperature distribution on the SiO2/Si substrate with heating electrodes and signal electrodes on the same plane with the aim of reducing the complexity of micro-machining process. Meanwhile, in order to obtain lower power consumption, two different structures of the SiO2/Si substrates with and without back etched were simulated, respectively. The simulation results showed that in the same heat rate and convection conditions, the back-etched SiO2/Si substrate had higher temperature, more uniform temperature distribution, and lower energy consumption. The Zn2SnO4/SnO2 cubes were obtained by annealing the as-synthesized precursors of ZnSn(OH)6 at 700 °C for 3 h. Thermal gravimetric and differential thermal analyzer, X-ray diffraction, Fourier transform infrared spectra, scanning electron microscopy, and energy-dispersive X-ray spectroscopy were analyzed to characterize the phase structure, composition, morphology, and elemental atomic ratio of Zn2SnO4/SnO2. The gas sensing properties of Zn2SnO4/SnO2 were tested, which showed that the gas sensor based on Zn2SnO4/SnO2 exhibited excellent formaldehyde sensing performance.


SnO2 Uniform Temperature Distribution Sick Building Syndrome Finite Element Analysis Software Signal Electrode 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



This subject was supported by the National Natural Science Foundation of China (61176068, 61001054, and 61131004) and the 973 Projects (2011CB302105) for financial supports.

Supplementary material

10853_2013_7808_MOESM1_ESM.doc (2.3 mb)
Supplementary material 1 (DOC 2405 kb)


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Copyright information

© Springer Science+Business Media New York 2013

Authors and Affiliations

  1. 1.School of Electronic Science and TechnologyDalian University of TechnologyDalianChina
  2. 2.School of Educational TechnologyShenyang Normal UniversityShenyangChina

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