High-temperature deformation behavior of Cu–6.0Ni–1.0Si–0.5Al–0.15 Mg–0.1Cr alloy
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The hot compression deformation behavior of Cu–6.0Ni–1.0Si–0.5Al–0.15 Mg–0.1Cr alloy with high strength, high stress relaxation resistance and good electrical conductivity was investigated using a Gleeble1500 thermal–mechanical simulator at temperatures ranging from 700 to 900 °C and strain rates ranging from 0.001 to 1 s−1. Working hardening, dynamic recovery and dynamic recrystallization play important roles to affect the plastic deformation behavior of the alloy. According to the stress–strain data, constitutive equation has been carried out and the hot compression deformation activation energy is 854.73 kJ/mol. Hot processing map was established on the basis of dynamic material model theories, and Prasad instability criterion indicates that the appropriate hot processing temperature range and strain rate range for hot deformation were 850~875 °C and 0.001~0.01 s−1, which agreed well with the hot rolling experimentation results.
KeywordsFlow Stress Dynamic Recrystallization Deformation Temperature True Strain Deformation Band
The authors are pleased to acknowledge the financial supply supported by the Hunan Provincial Natural Science Foundation of China (11JJ2025), the Nonferrous Metals Science Foundation of HNG-CSU (y2010-01-004), the Undergraduate Innovative Research Training Program of Central South University (CL11060, AL11491) and the Technology Innovative Research Team in Higher Educational Institutions of Hunan Province. Qian Lei expresses his gratitude to the Hunan Provincial Innovation Foundation for Postgraduate (CX2011B107), the Excellent Doctor Degree Thesis Support Foundation of Central South University (2011ybjz013) and the scholarship award for excellent doctoral student granted by Ministry of Education.
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