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Interfacial interaction of solid cobalt with liquid Pb-free Sn–Bi–In–Zn–Sb soldering alloys

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Abstract

Dissolution kinetics of cobalt in liquid 87.5%Sn–7.5%Bi–3%In–1%Zn–1%Sb and 80%Sn–15%Bi–3%In–1%Zn–1%Sb soldering alloys and phase formation at the cobalt–solder interface have been investigated in the temperature range of 250–450 °C. The temperature dependence of the cobalt solubility in soldering alloys was found to obey a relation of the Arrhenius type cs = 4.06 × 102 exp (−46300/RT) mass% for the former alloy and cs = 5.46 × 102 exp (−49200/RT) mass% for the latter, where R is in J mol−1 K−1 and T in K. For tin, the appropriate equation is cs = 4.08 × 102 exp (−45200/RT) mass%. The dissolution rate constants are rather close for these soldering alloys and vary in the range (1–9) × 10−5 m s−1 at disc rotational speeds of 6.45–82.4 rad s−1. For both alloys, the CoSn3 intermetallic layer is formed at the interface of cobalt and the saturated or undersaturated solder melt at 250 °C and dipping times up to 1800 s, whereas the CoSn2 intermetallic layer occurs at higher temperatures of 300–450 °C. Formation of an additional intermetallic layer (around 1.5 μm thick) of the CoSn compound was only observed at 450 °C and a dipping time of 1800 s. A simple mathematical equation is proposed to evaluate the intermetallic-layer thickness in the case of undersaturated melts. The tensile strength of the cobalt-to-solder joints is 95–107 MPa, with the relative elongation being 2.0–2.6%.

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Acknowledgements

This investigation was supported in part by the CRDF Grant No. UKE2-2698-KV-06. The authors thank D.M. Pashko for machining cobalt specimens and other mechanical work, L.A. Duma for taking X-ray patterns, L.M. Kuzmenko for carrying out chemical analyses, E.S. Rabotina for making metallic cross-sections, and I.G. Kondratenko and S.V. Bykova for their help in conducting the experiments.

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Authors and Affiliations

  1. Department of Physical Chemistry of Inorganic Materials, Institute for Problems of Materials Science, 03180, Kyiv, Ukraine

    V. I. Dybkov, V. G. Khoruzha, V. R. Sidorko, K. A. Meleshevich & A. V. Samelyuk

  2. Department of Materials Science and Engineering, Carnegie Mellon University, Pittsburgh, PA, 15213, USA

    D. C. Berry & K. Barmak

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  1. V. I. Dybkov
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  2. V. G. Khoruzha
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  3. V. R. Sidorko
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  4. K. A. Meleshevich
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  5. A. V. Samelyuk
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  6. D. C. Berry
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Correspondence to V. I. Dybkov.

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Dybkov, V.I., Khoruzha, V.G., Sidorko, V.R. et al. Interfacial interaction of solid cobalt with liquid Pb-free Sn–Bi–In–Zn–Sb soldering alloys. J Mater Sci 44, 5960–5979 (2009). https://doi.org/10.1007/s10853-009-3717-z

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