Abstract
The thermoelastic behavior of glass fiber-reinforced resin matrix composites is very important in several applications such as electronic packaging. Simulation of the composite behavior is complicated because of the complex nature of woven fiber architecture. In this study, we have conducted a numerical simulation of elastic and thermal expansion behavior of woven glass fiber-reinforced resin matrix composite. The simulations were compared to experimental data, showing excellent agreement with elastic properties and fairly good results for the thermal expansion coefficient of the composite.
Similar content being viewed by others
References
Kutz M (ed) (2002) Handbook of materials selection. Wiley, New York
Glazer JJ (1994) J Electron Mater 23(8):693. doi:https://doi.org/10.1007/BF02651361
Wood EP, Nimmo KL (1994) J Electron Mater 23:709. doi:https://doi.org/10.1007/BF02651363
Abtew M, Selvardery G (2000) Mater Sci Eng Rep 27:95. doi:https://doi.org/10.1016/S0927-796X(00)00010-3
Deng X, Piotrowski G, Williams JJ, Chawla N (2003) J Electron Mater 32:1403. doi:https://doi.org/10.1007/s11664-003-0108-0
Wu CML, Lai JKL, Wu YL (1998) Finite Elem Anal Des 30:19. doi:https://doi.org/10.1016/S0168-874X(98)00028-6
Yamada SE (1987) Eng Fract Mech 27:315. doi:https://doi.org/10.1016/0013-7944(87)90149-4
Rice JR (1988) J Appl Mech Trans ASME 55:98
Xie DJ, Wang ZP (1998) Finite Elem Anal Des 30:31. doi:https://doi.org/10.1016/S0168-874X(98)00032-8
Darveaux R, Banerji K, Mawer A, Dody G (1995) In: Lau JH (ed) Ball grid array technology. McGraw-Hill, New York, p 379
Solomon HD (1994) In: Fear DR, Burchett SN, Morgan HS, Lau JH (eds) The mechanics of solder alloy interconnects. Van Norstrand Reinhold, New York, p 199
Yang QJ, Shi XQ, Wang ZP, Shi ZF (2003) Finite Elem Anal Des 39:819. doi:https://doi.org/10.1016/S0168-874X(02)00134-8
Lau JH, Pao YH (1997) Solder joint reliability of BGA, CSP, flip chip, and fine pitch smt assemblies. McGraw-Hill, New York
Shi XQ, Zhou W, Pang HLJ, Wang ZP (1999) J Electron Packaging 121(3):179. doi:https://doi.org/10.1115/1.2792681
Tabiei A, Ivanov I (2004) Int J Non-linear Mech 39:175. doi:https://doi.org/10.1016/S0020-7462(02)00067-7
Ishikawa T, Chou TW (1982) J Compos Mater 16:2. doi:https://doi.org/10.1177/002199838201600101
Hahn HT, Tsai SW (1973) J Compos Mater 7:102
Naik RA (1995) J Compos Mater 29:2334
Ivanov I, Tabiei A (2001) Compos Struct 54(4):489. doi:https://doi.org/10.1016/S0263-8223(01)00121-0
Seifert OE, Schumacher SC, Hansen AC (2003) Compos Part B 34:571. doi:https://doi.org/10.1016/S1359-8368(03)00078-7
Zako M, Uetsuji Y, Kurashiki T (2003) Compos Sci Technol 63:507. doi:https://doi.org/10.1016/S0266-3538(02)00211-7
Ellyin F, Xia Z, Chen Y (2002) Compos Part A 33:399. doi:https://doi.org/10.1016/S1359-835X(01)00112-9
Chawla N, Tur YK, Holmes JW, Barber JR, Szweda A (1998) J Am Ceram Soc 81:1221
Shuler SF, Holmes JW, Wu X, Roach D (1993) J Am Ceram Soc 76:2327. doi:https://doi.org/10.1111/j.1151-2916.1993.tb07772.x
Chawla N, Chawla KK (2006) Metal matrix composites. Springer, New York
Schapery RA (1968) J Compos Mater 2:380. doi:https://doi.org/10.1177/002199836800200308
Acknowledgements
The authors acknowledge the financial support for this work from Isola Laminates Inc. We thank Mr. Tarun Amla for providing the experimental data for Young’s modulus and coefficient of thermal expansion.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Deng, X., Chawla, N. Three-dimensional (3D) modeling of the thermoelastic behavior of woven glass fiber-reinforced resin matrix composites. J Mater Sci 43, 6468–6472 (2008). https://doi.org/10.1007/s10853-008-2982-6
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10853-008-2982-6