Abstract
New interconnect materials are always necessary as a result of evolving packaging technologies and increasing performance and environmental demands on electronic systems. Polymer-based conductive-adhesive materials have become widely used in many electronic packaging interconnect applications. Among all the conductive-adhesive materials, the anisotropic conductive adhesives (ACA) (or anisotropic conductive adhesive films, ACF) have gained popularity as a potential replacement for solder interconnects. The interest in using ACA instead of solder comes partly from the fact that the use of ACA for the direct interconnection of flipped silicon chips to printed circuits (flip chip packaging) offers numerous advantages such as reduced thickness, improved environmental compatibility, lowered assembly process temperature, increased metallization options, reduced cost, and decreased equipment needs. In this review, a summary of our understanding of the electrical, physical, thermal, chemical, environmental, and cost behaviors of ACA in conjunction with various packaging applications is elaborated. First, the formulation and curing kinetics of ACA materials, as well as the conduction mechanisms of ACA joints, are introduced; second, the influencing factors, including the boding process (boding temperature, boding pressure, curing conditions, reflow and misalignment processes, etc), the environmental factors (temperature, humidity, impact load, etc), and the properties of the components (the properties of the ACA, substrates, conductive particles, the bump height, etc), on the reliability of ACA joining technology are presented. Finally, future research areas and remaining issues are pointed out. The purpose is simply to pinpoint the most important papers that have played significant role for the advancement of the ACA bonding technology.
Similar content being viewed by others
References
Liu J (1998) In: Conductive adhesives for electronics packaging. Electrochemical Publications, UK
Nagai A, Takemure K, Isaka K, Watanabe O, Kojima K, Matsuda K, Watanabe I (1998) In: Proceedings of the IEMT/IMC, Tokyo, Japan, 1998, p 353
Lu D, Tong QK, Wong CP (1999) In: Proceedings of the 49th ECTC, San Diego, CA, USA, 1999, p 347
Liu J, Lundstorm P (1999) In: Liu J (ed) Conductive adhesive for electronic packaging. Electrochemical Publications, New York, p 212
Lu D, Wong CP (2000) In: Proceedings of the international symposium on advanced packaging materials: processes, properties and interfaces, Braselton, GA, 2000, p 24
Liu J (2001) Solder Surf Mt Technol 13:39
Lau J, Wong CP, Lee NC, Lee SWR (2002) In: Electronics manufacturing: with lead-free, halogen-free, and conductive adhesive materials. McGraw Hill, New York
Tan AM, Lim SPS, Lee C (2003) In: Proceedings of the 5th electronics packaging technology, Pan Pacific Hotel, Singapore, 2003, p 390
Savolainen P, Saarinen I, Rusanen O (2004) In: Proceedings of the 4th international IEEE conference on polymers and adhesives in microelectronics and photonics, Portland, OR, 2004, p 99
Li Y, Wong CP (2004) In: Proceedings of the 4th international IEEE conference on ‘polymers and adhesives in microelectronics and photonics’, Portland, OR, 2004, p 1
Li Y, Moon K, Wong CP (2005) Science 308:1419
Li Y, Wong CP (2006) Mater Sci Eng R 51:1
Watanabe I, Fujinawa T, Arifuku M, Fujii M, Gotoh Y (2004) In: Proceedings of the 9th IEEE international symposium on advanced packaging materials: processes, properties and interfaces, Atlanta, GA, 2004, p 11
Reinke RR, Kennedy TW (1988) In: Proceedings of the SID international symposium on digest of technical papers, 1988, p 305
Hu DC, Ho SJ, Tang BY (1992) In: Proceedings of the 13th IEEE/CHMT international electronics manufacturing technology symposium, 1992, p 277
Lee CH, Loh KI (1995) In: Proceedings of the 45th ECTC, Las Vegas, NV, 1995, p 21
Baumbach J, Baur H, Lueder E, Yamauchi A, Dorfmueller L, Knoll PM (1999) In: Proceedings of the international symposium of society for information display, San Jose, CA, 1999, p 848
Watanabe I, Fujinawa T, Arifuku M, Kobayashi K, Gotoh Y (2004) In: Proceedings of the international IEEE conference on the Asian green electronics, Hongkong/Shenzen, China, 2004, p 229
Otsuki H, Morishita H, Kokogawa T, Adachi K, Matsukawa F, Takasago H (1991) In: Proceedings of the international symposium on microelectronics, 1991, p 86
Liu J, Boustedt K, Lai ZH (1996) Circ World 22:19
Miessner R, Aschenbrenner R, Reichi H, Ling S, Binh L, Lew A, Benson R, Nhan E (2000) In: Proceedings of the 50th ECTC, Las Vegas, NV, 2000, p 1133
Li L, Treliant F (2000) In: Proceedings of the 4th IEEE international conference on adhesive joining and coating technology in electronics manufacturing, Espoo, Finland, 2000, p 129
Gustafsson K, Mannan S, Liu J, Lai ZH, Whalley D, Williams D (1997) In: Proceedings of the 47th ECTC, San Jose, CA, May 1997, p 561
Liu J (1999) The advanced flip-chip workshop, Atlanta, USA
Miessner R, Aschenbrenner R, Reichl H (1999) In: Proceedings of the 49th ECTC, San Diego, CA, 1999, p 595
Ogunjimi AO, Mannan SH, Whalley DC, Williams DJ (1996) IEEE Trans Comp Package 19:257
Oguibe CN, Mannan SH, Whalley DC, Williams DJ (1998) In: Proceedings of the 3rd IEEE international conference on adhesive joining and coating technology in electronics manufacturing, Binghamton, New York, 1998, p 27
Zhong ZW (2001) Microelectron Int 18:15
Mannan SH, Williams DJ, Whalley DC (1997) J Mater Sci-Mater Electron 8:223
Cao LQ, Li SM, Lai ZH, Liu J (2005) J Electron Mater 34:1420
Sarker G, Mridha S, Chong TT, Tuck WY, Kwan SC (1999) J Mater Process Technol 484:89
Lai Z, Liu J (1996) IEEE Trans Comp Package B 19:644
Wu SX, Zhang C, Yeh CP, Wille S, Wyatt K (1997) In: Proceedings of the 47th ECTC, San Jose, CA, 1997, p 550
Chan YC, Uddin MA, Alam MO, Chan HP (2003) J Electron Mater 32:131
Zhuqing Z, Wong CP (2002) In: Proceedings of the 8th international symposium on advanced packaging materials, Piscataway, NJ, 2002, p 194
Xiao AY, Jacobson SH (1999) In: Proceedings of the 5th international symposium on advanced packaging materials, Chateau Elan, Braselton, GA, 1999, p 21
Rogers AD, Pearl LS (2003) Polym Eng Sci 43:14
Hsu DT, Kim HK, Shi FG, Tong HY, Chungpaiboonpatana S, Davidson C, Adams JM (2000) Microelectron Int 17:22
Wu X, Hao H (2005) J Manuf Sci Eng 127:411
Lee JY, Shim MJ, Kim SW (1997) Mater Chem Phys 48:36
Lin F, Bhatia GS, Ford JD (1993) Appl Polym Sci 49:1901
Roşu D, Caşcaval CN, Mustatǎ F, Ciobanu C (2002) Thermochim Acta 383:119
Prime RB (1997) In: Thermal characterization of polymeric materials, 2nd edn. Academic Press, New York, p 1598
Barral L, Cano J, López J, López-Bueno I, Nogueira P, Torres A, Ramírez C, Abad MJ (2000) Thermochim Acta 344:127
Williams DJ, Whalley DC, Boyle OA, Ogunjimi AO (1993) Solder Surf Mt Techol 14:4
Hu KX, Yeh CP, Wyatt KW (1997) IEEE Trans Comp Package Manuf Technol A 20:470
Yim MJ, Paik KW (1998) IEEE Trans Comp Package Manuf Technol A 21:226
Shi FG, Abdullah M, Chungpaiboonpatana S, Okuyama K, Davidson C, Adams JM (1999) Mater Sci Semicond Process 2:263
Oguibe CN, Mannan SH, Whalley DC, Williams DJ (1998) IEEE Trans Comp Package Manuf Technol A 21:235
Fu Y, Willanter M, Liu J (2001) IEEE Trans Comp Package Technol 24:250
Chin M, Iyer KA, Hu SJ (2004) IEEE Trans Comp Package Technol 27:317
Constable JH (2006) IEEE Trans Comp Package Technol 29:494
Chiu YW, Chan YC, Lui SM (2002) Microelectron Reliab 42:1945
Connell G, Zenner RLD, Gerber JA (1997) In: Proceedings of the 47th ECTC, San Jose, CA, 1997, p 274
Chan YC, Luk DY (2002) Microelectron Reliab 42:1185
Luk CF, Chan YC, Hung KC (2002) Microelectron Reliab 42:767
Zhang JH, Chan YC, Zeng ZM, Chiu YW (2002) In: Proceedings of the 52nd ECTC, San Diego, CA, 2002, p 1569
Wu YP, Alam MO, Chan YC, Wu BY (2004) Microelectron Reliab 44:295
Zhang JH, Chan YC (2004) In: Proceedings of the 6th IEEE conference on high density microsystem design and packaging and component failure analysis, Shanghai, China, 2004, p 277
Tan SC, Chan YC, Chiu YW, Tan CW (2004) Microelectron Reliab 44:495
Uddin MA, Alam MO, Chan YC, Chan HP (2004) Microelectron Reliab 44:505
Rizvi MF, Chan YC, Bailey C, Lu H, Sharif A (2005) Solder Surf Mt Technol 17:40
Chen X, Zhang J (2005) Key Eng Mater 297:918
Chen X, Zhang J, Jiao C, Yu L (2006) Microelectron Reliab 46:774
Chan YC, Luk DY (2002) Microelectron Reliab 42:1195
Williams DJ, Whalley DC (1993) J Electron Manuf 3:85
Mannan SH, Williams DJ, Whalley DC, Ogunjimi AO (1999) In: Liu J (ed) Conductive adhesives for electronics packaging, Ch. 4. Electrochemical Publications Ltd, Port Erin
Zou G, Grönqvist H, Liu J (2004) IEEE Trans Comp Package Technol 27:546
Yim MJ, Hwang J, Paik KW (2007) Int J Adhes Adhes 27:77
Kang IB, Haskard MR, Ju BK (1996) In: Proceedings of the SPIE—the international society for optical engineering, San Jose, CA, 1996, p 280
Yim MJ, Paik KW, Kim YK, Hwang HN (1997) In: Proceedings of the Pacific Rim/ASME international intersociety electronic and photonic packaging conference, New York, 1997, p 65
Pinardi K, Liu J, Haug R, Treutler C, Willander M (1998) In: Proceedings of the 3rd IEEE international conference on adhesive joining and coating technology in electronics manufacturing, Binghamton, New York, 1998, p 34
Yim MJ, Paik KW (1999) IEEE Trans Adv Package 22:166
Prabhakumar A, Constable JH (2001) In: Proceedings of the 51st electronic component and technology conference, Orlando, Florida USA, 2001, p 580
Frisk L, Seppälä A, Ristolainen E (2004) Microelectron Reliab 44:1305
Seppälä A, Ristolainen E (2004) Microelectron Reliab 44:639
Lim Pei Siang S, Tan AM, Lee C (2004) In: Proceedings of the 6th electronics packaging technology conference, Shenzhen, China, 2004, p 450
Lee KK, Ng KT, Tan CW, Chan YC, Cheng LM (2004) In: Proceedings of the international conference on ‘the business of electronic product reliability and liability’, Shanghai, China, 2004, p 134
Chan KK, Yeung NH, Chan YC, Tan SC, Lee KK (2003) In: Proceedings of the 53rd ECTC, LA, 2003, p 1701
Miessner R, Aschenbrenner R, Reichl H (1999) In: Proceedings of the 49th electronic component and technology conference, San Diego, CA, 1999, p 595
Cao LQ, Lai ZH, Liu J (2004) In: Proceedings of the 6th IEEE conference on high density microsystem design and packaging and component failure analysis, Shanghai, China, 2004, p 254
Inoue M, Miyamoto T, Suganuma K (2004) In: Proceedings of the 6th IEEE conference on ‘high density microsystem design and packaging and component failure analysis’, Shanghai, China, 2004, p 248
Lee KK, Tan SC, Chan YC (2005) J Electron Package 127:52
Zhang J, Jia H, Chen X (2006) J Electron Packag 6:33
Seppälä A, Ristolainen E (2004) Microelectron Reliab 44:639
Sugiyama T (2000) In: The latest bare chip bonding by ACF, documentation from Sony Chemicals Seminar at Chalmers University of Technology
Törnvall M (2000) In: Proceedings of a Swedish national seminar on environmentally compatible materials research for electronics packaging, IVF, Sweden, 2000, IVF 5
Yin CY, Alam MO, Chan YC, Bailey C, Lu H (2003) Microelectron Reliab 43:625
Yin CY, Lu H, Bailey C, Chan YC (2004) In: Proceedings of the international IEEE conference on the Asian green electronics, Hongkong/Shenzen, China, 2004, p 240
Chiang WK, Chan YC (2004) In: Proceedings of the international IEEE conference on the Asian green electronics, Hongkong/Shenzen, China, 2004, p 235
Yin CY, Lu H, Bailey C, Chan YC (2004) IEEE Trans Electron Package Manuf 27:254
Chiang WK, Chan YC (2005) J Electron Package 127:113
Wong CC (1993) In: Doane DA, Franzon PD (eds) Multichip module technologies and alternatives. Van Nostrand Reinhold, New York, p 429
Fan SH, Chan YC (2002) Microelectron Reliab 42:1081
Fan SH, Chan YC (2002) In: Proceedings of the 52nd ECTC, San Diego, CA, 2002, p 1605
Xie B, Shi XQ, Ding H, Qiao K (2006) In: Proceedings of the 10th intersociety conference on thermal and thermomechanical phenomena in electronics systems, San Diego, CA, 2006, p 848
Liu J (1993) Circ World 19:4
Stam F, O’Grady P, Barrett J (1995) J Electron Manuf 5:1
Lai ZH, Liu J (1996) IEEE Trans Comp Package Technol B 19:644
Liu J, Tolvgard A, Malmodin J, Lai Z (1999) IEEE Trans Comp Package Technol 22:186
Weidler JD, Burg RD, Decker JJ, Constable JH (2000) In: Proceedings of the 50th ECTC, Las Vegas, NV, 2000, p 906
Lefebvre DR (2000) J Adhes Sci Technol 14:925
Liu J (2001) In: Proceedings of the 1st international IEEE conference on ‘polymers and adhesives in microelectronics and photonics’, Potsdam, Germany, 2001, p 209
Fujiwara S, Harada M, Fujita Y, Hachiya T, Muramatsu M (2002) In: Proceedings of the 52nd ECTC, San Diego, CA, 2002, p 1124
Wu CML, ML Chau (2002) Solder Surf Mt Technol 14:51
Wei Z, Waf LS, Loo NY, Koon EM, Huang M (2002) In: Proceedings of the 4th EPTC, Grand Copthorne Waterfront Hotel, Singapore, 2002, p 133
Tan CW, Chan YC, Yeung NH (2002) Microelectron Reliab 43:481
Tan CW, Chan YC, Yeung NH (2003) Microelectron Reliab 43:279
Tan CW, Chiu YW, Chan YC (2003) Mat Sci Eng B-Solid 98:255
Wang ZP (2003) In: Proceedings of the 5th EPTC, Pan Pacific Hotel, Singapore, 2003, p 595
Mercado LL, White J, Sarihan V, Lee TYT (2003) IEEE Trans Comp Package Technol 26:509
Zhang JH, Chan YC (2003) J Electron Mater 32:228
Zhang JH, Chan YC (2004) In: Proceedings of the 6th IEEE conference on high density microsystem design and packaging and component failure analysis, Shanghai, China, 2004, p 277
Uddin MA, Chan YC, Chan HP, Alam MO (2004) J Electron Mater 33:14
Wu YP, Alam MO, Chan YC, Wu BY (2003) In: Proceedings of the 53rd ECTC, New Orleans, LA, 2003, p 544
Chen X, Zhang J, Wang ZP (2004) In: Proceedings of the 9th intersociety conference on thermal and thermomechanical phenomena in electronics systems, Las Vegas, NV, 2004, p 453
Kwon WS, Ham SJ, Yim MJ, Lee SB, Paik KW (2005) J Electron Package 127:86
Yang SY, Kwon WS, Lee SB, Paik KW (2005) Key Eng Mater 297–300:887
Teh LK, Teo M, Anto E, Wong CC, Mhaisalkar SG, Teo PS, Wong EH (2005) IEEE Trans Comp Package Technol 28:506
Kwon WS, Paik KW (2006) Microelectron Reliab 46:589
Lin YC, Chen X, Wang ZP (2006) J Adhes Sci Technol 20:1383
Lin YC, Chen X, Zhang HJ, Wang ZP (2006) Mater Lett 60:2958
Zhang J, Chen X, Jia H (2006) J Zhengzhou Univer 27:48
Chen X, Zhang J (2006) Key Eng Mater 324:471
Luo SJ, Leisen J, Wong CP (2002) J Appl Polym Sci 85:1
Leung SYY, Lam DCC, Luo SJ, Wong CP (2004) J Adhes Sci Technol 18:1103
Lin YC, Chen X (2005) Polymer 46:11994
Lin YC, Chen X (2005) Chem Phys Lett 412:322
Lin YC, Chen X (2005) Mater Lett 59:3831
Lin YC (2006) In: Investigation of characteristics for adhesive and bonding reliability for COG assembly under hygrothermal conditions, PhD thesis, Tianjin University, Tianjin, China
Lu D, Tong QK, Wong CP (1999) IEEE Trans Comp Package Manuf Technol C 22:228
Lu D, Wong CP (1999) In: Proceedings of the 2nd international IEEE symposium on polymeric electron packaging, 1999, p 1
Lu D, Wong CP (2000) IEEE Trans Comp Package Technol 23:440
Shimada Y, Lu DQ, Wong CP (2000) J Electron Manuf 10:97
Lin YC, Chen X, Wang ZP (2006) In: Proceedings of the 10th intersociety conference on thermal and thermomechanical phenomena in electronics systems, San Diego, CA, 2006, p 826
Rizvi MJ, Chan YC, Bailey C, Lu H (2005) Microelectron Reliab 45:589
Lin YC, Chen X, Wang ZP (2006) In: Proceedings of the 10th intersociety conference on thermal and thermomechanical phenomena in electronics systems, San Diego, CA, 2006, p 946
Rizvi MJ, Bailey C, Chan YC, Lu H (2006) In: Proceedings of the 10th intersociety conference on thermal and thermomechanical phenomena in electronics systems, San Diego, CA, 2006, p 855
Ali L, Chan YC, Alam MO (2005) Solder Surf Mt Technol 17:20
Islam RA, Chan YC, Ralph B (2004) J Mater Res 19:1662
Lam DCC, Shen C, Xie JF, Karim Z, Tong P (1996) In: Proceedings of the electronic packaging materials science IX. Symp, Boston, MA, 1996, p 297
Lai ZH, Lai R, Persson K, Liu J (1998) J Electron Manuf 8:217
Persson K, Lai Z, Zribi A, Liu J, Willander M (1998) In: Proceedings of the 3rd IEEE international conference on adhesive joining and coating technology in electronics manufacturing, Binghamton, NY, 1998, p 132
Pinardi K, Lai Z, Vogel D, Yi LK, Liu J, Liu S, Haug R, Willander M (2000) IEEE Trans Comp Package Manuf Technol 23:447
Pinardi K, Lai Z, Yi LK, Liu J, S Liu, Haug R (2000) In: Proceedings of the 50th ECTC, Las Vegas, NV, 2000, p 1118
Wu CML, Liu J, Yeung NH (2000) In: Proceedings of the 4th IEEE international conference on adhesive joining and coating technology in electronics manufacturing’, Espoo, Finland, 2000, p 101
Wu CML, Liu J, Yeung NH (2001) Solder Surf Mt Technol 13:25
Yim MJ, Jeon YD, Paik KW (2000) IEEE Trans Electron Package Manuf 23:171
Yim MJ, Paik KW (2001) IEEE Trans Comp Package Manuf Technol 24:24
Kwon WS, Paik KW (2003) In: Proceedings of the 3rd international IEEE conference on polymers and adhesives in microelectronics and photonics, Montreux, Switzerland, 2003, p 351
Teo M, Mhaisalkar SG, Wong EH, Teo PS, Wong CC, Ong K, Goh CF (2003) In: Proceedings of the 5th electronics packaging technology conference, Pan Pacific Hotel, Singapore, 2003, p 718
Teo M, Mhaisalkar SG, Wong EH, Teo PS, Wong CC, Ong K, Goh CF, Teh LK (2005) IEEE Trans Comp Package Technol 28:157
Hwang JS, Yim MJ, Paik KW (2005) J Electron Mater 34:1455
Hwang JS, Yim MJ, Paik KW (2006) J Electron Mater 35:1722
Yim MJ, Kim HJ, Chung CK, Paik KW (2006) In: Proceedings of the 56th ECTC, San Diego, CA, 2006, p 338
Liu J, Lai Z (1999) In: Proceedings of the international intersociety on electronic packaging technical/business conference & exhibition, Maui, HI, 1999, p 1691
Seppälä A, Pienimaa S, Ristolainen E (2001) Int J Microcircuits Electron Package 24:148
Fan SH, Chan YC (2003) J Electron Mater 32:101
Yeung NH, Chan YC, Tan CW (2003) J Electron Package 125:624
Sarkar G, Mridha S, Tan TC, Wu YT, Sem CK (1999) J Mater Process Technol 89–90:484
Paik KW, Yim MJ, Kwon WS (2001) In: Proceedings of the 6th annual Pan Pacific microelectronics symposium, Kauai, HA, 2001, p 217
Dou GB, Chan YC, Liu J (2003) J Electron Package 125:609
Cao LQ, Li SM, Lai ZH, Liu J (2005) J Electron Mater 34:1420
Acknowledgement
This work was supported by China Postdoctoral Science Foundation (Grant No. 20070410302), the Science Research Foundation Program of Central South University, and the Postdoctoral Science Foundation of Central South University.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Lin, Y.C., Zhong, J. A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications. J Mater Sci 43, 3072–3093 (2008). https://doi.org/10.1007/s10853-007-2320-4
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10853-007-2320-4