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Journal of Materials Science

, Volume 43, Issue 1, pp 88–97 | Cite as

Interface layer effect on the stress distribution of a wafer-bonded bilayer structure

  • Yin Zhang
Article

Abstract

The interface layer plays an important role in stress transfer in composite structures. However, many interface layer properties such as the modulus, thickness, and uniformity are difficult to determine. The model developed in this article links the influence of the interface layer on the normal stress distribution along the layer thickness with the layer surface morphology before bonding. By doing so, a new method of determining the interfacial parameter(s) is suggested. The effects of the layer thickness and the surface roughness before bonding on the normal stress distribution and its depth profile are also discussed. For ideal interface case with no interfacial shear stress, the normal stress distribution pattern can only be monotonically decreased from the interface. Due to the presence of interfacial shear stress, the normal stress distribution is much more complex, and varies dramatically with changes in the properties of the interface layer, or the dimensions of the bonding layers. The consequence of this dramatic stress field change, such as the shift of the maximum stress from the interface is also addressed. The size-dependent stress distribution in the thickness direction due to the interface layer effect is presented. When the interfacial shear stress is reduced to zero, the model presented in this article is also demonstrated to have the same normal stress distribution as obtained by the previous model, which does not consider the interface layer effect.

Keywords

Normal Stress Interface Layer Interfacial Shear Stress Interfacial Parameter Feature Thickness 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgements

The author is thankful for the financial support of the National Natural Science Foundation of China (NSFC, Grant No. 10502050) and the Scientific Research Foundation for the Returned Overseas Chinese Scholars, State Education Ministry.

References

  1. 1.
    Pipes RB, Pagano NJ (1970) J Compos Mater 4:538Google Scholar
  2. 2.
    Pipes RB, Moiré IM (1971) J Compos Mater 5:255CrossRefGoogle Scholar
  3. 3.
    Pagano NJ (1978) Int J Solids Struct 14:385CrossRefGoogle Scholar
  4. 4.
    Pagano NJ (1978) Int J Solids Struct 14:401CrossRefGoogle Scholar
  5. 5.
    Wang SS, Choi I (1982) J Appl Mech 49:541Google Scholar
  6. 6.
    Wang SS, Choi I (1982) J Appl Mech 49:549CrossRefGoogle Scholar
  7. 7.
    Hu SM (1979) J Appl Phys 50:4661CrossRefGoogle Scholar
  8. 8.
    Hu SM (1991) J Appl Phys 70:R53CrossRefGoogle Scholar
  9. 9.
    Chen WT, Nelson CW (1979) IBM J Res Develop 23:179CrossRefGoogle Scholar
  10. 10.
    Suhir E (1986) J Appl Mech 53:657Google Scholar
  11. 11.
    Suhir E (1989) J Appl Mech 56:595Google Scholar
  12. 12.
    Timoshenko S (1925) J Opt Soc Am 11:233CrossRefGoogle Scholar
  13. 13.
    Ru CQ (2002) J Electron Packag 124:141CrossRefGoogle Scholar
  14. 14.
    Noyan IC, Murray CE, Chey JS, Goldsmith CC (2004) Appl Phys Lett 85:724CrossRefGoogle Scholar
  15. 15.
    Murray CE, Noyan IC (2002) Philos Mag A 82:3087Google Scholar
  16. 16.
    Maszara WP, Jiang BL, Yamada A, Rozgonyi GA, Baumgart H, de Kock AJR (1990) J Appl Phys 69:257CrossRefGoogle Scholar
  17. 17.
    Stengl R, Mitani K, Lehmann V, Gösele U (1989) Proc. 1989 IEEE SOS/SOI Tech. Conf., Stateline, Nevada, October 3–5, 1989, IEEE Catalog number 89CH2796–1(1989) 123Google Scholar
  18. 18.
    Tong QY, Gösele U (1995) J Electrochem Soc 142:3975CrossRefGoogle Scholar
  19. 19.
    Yu HH, Suo Z (1998) J Mech Phys Solids 46:829CrossRefGoogle Scholar
  20. 20.
    Kendall K (2001) Molecular adhesion and its application: the sticky universe. Kluwer Academic /Plenum Publishers, NY, p 28Google Scholar
  21. 21.
    Gui C, Elwenspoek M, Tas N, Gardeniers JGE (1999) J Appl Phys 85:7448CrossRefGoogle Scholar
  22. 22.
    Liau ZL (1997) Phys Rev B 55:12899CrossRefGoogle Scholar
  23. 23.
    Lee WG, Woo SI (1997) J Mater Sci 32:815CrossRefGoogle Scholar
  24. 24.
    Chen KN, Fan A, Reif R (2002) J Mater Sci 37:3441CrossRefGoogle Scholar
  25. 25.
    Freund LB, Suresh S (2003) Thin film materials: stress, defect formation and surface evolution. Cambridge University Press, UKGoogle Scholar
  26. 26.
    Zhang Y (2007) J Phy D Appl Phy 40:1118CrossRefGoogle Scholar
  27. 27.
    Pinard K, Jain SC, Willander M, Atkinson A, Maes HE, Van Overstraeten R (1998) J Appl Phys 84:2507CrossRefGoogle Scholar
  28. 28.
    Maszara WP, Goetz G, Caviglia A, McKitterick JB (1988) J Appl Phys 64:4943CrossRefGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  1. 1.State Key Laboratory of Nonlinear Mechanics (LNM)Institute of Mechanics, Chinese Academy of SciencesBeijingP.R. China

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