Journal of Materials Science

, Volume 42, Issue 24, pp 10040–10046 | Cite as

Development and characterization of magnesium composites containing nano-sized silicon carbide and carbon nanotubes as hybrid reinforcements



Magnesium based hybrid composites containing nano-sized silicon carbide and carbon nanotubes reinforcements with minimal porosity were successfully fabricated using powder metallurgy technique with microwave sintering and hot extrusion. It was found that the addition of nano-sized silicon carbide and carbon nanotubes reinforcements lowered the coefficient of thermal expansion of magnesium. Moreover, increasing presence of silicon carbide particles led to a progressive reduction in coefficient of thermal expansion for a constant overall amount of reinforcements indicating that carbon nanotubes lowered the coefficient of thermal expansion to a lesser extent when compared to silicon carbide. Micro-hardness, 0.2% YS and UTS (except for Mg+1%CNT) showed improvement, while failure strain decreased when nano-sized silicon carbide and carbon nanotubes were added to magnesium. The failure mode of magnesium and magnesium composites was predominantly brittle exhibiting the presence of cleavage steps.


Silicon Carbide Ultimate Tensile Strength Failure Strain Microwave Sinter Magnesium Matrix 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.



The authors acknowledge the help rendered by Adlin Idris, NUS and Delphi Automotive Systems (Singapore) Pte Ltd. for carrying out the present work.


  1. 1.
    Hort N, Dieringa H, Thakur SK, Kainer KU (2006) In: Friedrich HE, Mordike BL (eds) Magnesium technology: metallurgy, design data, applications. Springer-Verlag, Berlin, pp 315–334Google Scholar
  2. 2.
    Schroder J, Kainer KU (1991) Mater Sci Eng A 135:33CrossRefGoogle Scholar
  3. 3.
    Ferkel H, Mordike BL (2001) Mater Sci Eng A 298:193CrossRefGoogle Scholar
  4. 4.
    Trojanova Z, Lukac P, Ferkel H, Mordike BL, Riehemann W (1997) Mater Sci Eng A 234–236:798Google Scholar
  5. 5.
    Special Feature (2004) Metal Powder Report 59:40Google Scholar
  6. 6.
    Goh CS, Wei J, Lee LC, Gupta M (2006) Nanotechnology 17:7CrossRefGoogle Scholar
  7. 7.
    Thakur SK, Dhindaw BK, Hort N, Kainer KU (2004) Metall Mater Trans A 35A:1167Google Scholar
  8. 8.
    Thakur SK, Dieringa H, Dhindaw BK, Hort N, Kainer KU (2005) Trans Indian Inst Metals 58:653Google Scholar
  9. 9.
    Michaud VJ (1993) In: Suresh S, Mortensen A, Needleman A (eds) Fundamentals of metal matrix composites. Butterworth-Heinemann, pp 3–22Google Scholar
  10. 10.
    Lee DM, Suh BK, Kim BG, Lee JS, Lee CH (1997) Mater Sci Technol 13:590Google Scholar
  11. 11.
    Gupta M, Wong WLE (2005) Script Mater 52:479CrossRefGoogle Scholar
  12. 12.
    Ye HZ, Liu XY (2004) J Mater Sci 39:6153CrossRefGoogle Scholar
  13. 13.
    German RM (1984) Powder metallurgy science. Metal Powder Industries Federation, USAGoogle Scholar
  14. 14.
    Geiger AL, Walker JA (1991) JOM 43:8Google Scholar
  15. 15.
    Ibrahim IA, Mohamed FA, Lavernia EJ (1991) J Mater Sci 26:1137CrossRefGoogle Scholar
  16. 16.
    Tekmen C, Ozdemir I, Cocen U, Onel K (2003) Mater Sci Eng A 360:365CrossRefGoogle Scholar
  17. 17.
    Chen X, Xia J, Peng J, Li W, Xie S (2000) Compos Sci Technol 60:301CrossRefGoogle Scholar
  18. 18.
    Whitehouse AF, Clyne TW (1993) Composites 24:256CrossRefGoogle Scholar
  19. 19.
    Luo A (1995) Metall Mater Trans A 26A:2445CrossRefGoogle Scholar
  20. 20.
    Bocchini GF (1986) Int J Powder Metall 22:185Google Scholar
  21. 21.
    Gupta M (1999) Aluminum Trans 1:33Google Scholar
  22. 22.
    Lloyd DJ (1994) Int Mater Rev 39:1Google Scholar
  23. 23.
    Reed-hill RE (1964) Physical metallurgy principles. D. Van Nostrand Company, New York, USA, p 753Google Scholar

Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  • Sanjay Kumar Thakur
    • 1
  • Gan Tai Kwee
    • 1
  • Manoj Gupta
    • 2
  1. 1.Division of Electronics and SafetyDelphi Automotive Systems Singapore Pte LtdSingaporeSingapore
  2. 2.Department of Mechanical Engineering, Faculty of EngineeringNational University of SingaporeSingaporeSingapore

Personalised recommendations