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Solidification behavior of Al–20.6%Cu alloy under AC magnetic field

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Authors and Affiliations

  1. The Key Lab of National Education Ministry for Electromagnetic Processing of Material, Northeastern University, P.O. Box 314, Shenyang, 110004, P.R. China

    Chunyan Ban, Jianzhong Cui, Yi Han & Qixian Ba

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  1. Chunyan Ban
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  2. Jianzhong Cui
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  3. Yi Han
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  4. Qixian Ba
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Correspondence to Chunyan Ban.

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Ban, C., Cui, J., Han, Y. et al. Solidification behavior of Al–20.6%Cu alloy under AC magnetic field. J Mater Sci 41, 3113–3115 (2006). https://doi.org/10.1007/s10853-006-5243-6

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  • DOI: https://doi.org/10.1007/s10853-006-5243-6

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