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Journal of Materials Science

, Volume 41, Issue 19, pp 6409–6416 | Cite as

Reaction products at brazed interface between Ag–Cu–V filler metal and diamond (111)

  • T. Yamazaki
  • A. Suzumura
Article

Abstract

The composition of a brazing-filler metal in an Ag–Cu–V system which was selected using lattice misfit data, was estimated using perturbation interface model and applied it to the brazing artificial single crystal diamond (111) by unidirectional-solidification brazing. An Ag-27.8Cu system containing less than 1mass%V brazing-filler metal provided stable joint strength (the shear strength at the brazed interface exceeded 200 MPa). Optical observation of the brazed interface revealed that silver crystal grains grew from vanadium carbide islands formed on the diamond. This behavior is consistent with a slight degree of lattice mismatch between silver and vanadium carbide crystals. Atomic force microscope observation revealed small scale islands of the reaction products with good adhesion are enough for brazing diamond (111). X-ray diffraction results indicated several types of vanadium carbides, V8C7, V4C3 and V2C were formed there, and V4C3 reaction product was considered to provide good adhesion between the filler metal and the diamond due to prefer solidification of silver on the reaction products islands.

Keywords

Vanadium Shear Strength Heterogeneous Nucleation Lattice Mismatch Filler Metal 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Notes

Acknowledgments

The authors are grateful to Tokyo Braze Co., Ltd., for supplying silver-copper eutectic foil and to E. Kurauchi, an AES member, for her help with EPMA analyses. This test program is supported by a NASDA Research Fellowship.

References

  1. 1.
    Wilks EM, Wilks J (1972) J Phys D 5:1902CrossRefGoogle Scholar
  2. 2.
    Casey M and Wilks J (1972) In: “Diamond research”. Industrial diamond information bureau, England, p 6Google Scholar
  3. 3.
    Yamazaki T, Suzumura A (2000) J Mater Sci 35:6155CrossRefGoogle Scholar
  4. 4.
    Naidich JUV (1981) Prog Surf Membr Sci 14:354Google Scholar
  5. 5.
    Scott PM, Nicholas M (1975) J Mater Sci 10:1833CrossRefGoogle Scholar
  6. 6.
    Grabow MH, Gilmer GH (1988) Surf Sci 194:333CrossRefGoogle Scholar
  7. 7.
    Bramfitt BL (1970) Mat Trans 1:1987Google Scholar
  8. 8.
    Crosley PB, Douglus AW and Mondolfo LF (1967) In: The solidification of metals. Iron and Steel Inst., p 10Google Scholar
  9. 9.
    Yamazaki T and Suzumura A (1996) In: Proceedings of the 6th International Symposium of Japan Welding Society, Nagoya, Japan Welding Society, p 125Google Scholar
  10. 10.
    Gleiter H (1987) In: Ishida Y (eds) Fundamentals of diffusion bonding. Elsevier, p 283Google Scholar
  11. 11.
    Tiller WA, Jackson RA, Rutter JW, Chalmers B (1953) Acta Metall 1:428CrossRefGoogle Scholar
  12. 12.
    Mullins WW, Sekerka RF (1963) J Appl Phys 34:323CrossRefGoogle Scholar
  13. 13.
    Mullins WW, Sekerka RF (1964) J Appl Phys 35:444CrossRefGoogle Scholar
  14. 14.
    Skapski AS (1956) Acta Metall 4:576CrossRefGoogle Scholar
  15. 15.
    Sudo H (1985) Materials for Mechanical Engineering. CORONA PUBLISHING CO., LTD, p 144. (in Japanese)Google Scholar
  16. 16.
    JSPDS-International Centre for Diffraction DataGoogle Scholar

Copyright information

© Springer Science+Business Media, LLC 2006

Authors and Affiliations

  1. 1.Technology Research Department, National Space Development Agency of JapanTsukuba Space CenterTsukuba, IbarakiJapan
  2. 2.Graduate School of Science and EngineeringTokyo Institute of TechnologyMeguro-ku, TokyoJapan

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