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Joining of TiAl intermetallic by self-propagating high-temperature synthesis

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Abstract

This study reports on a novel approach for joining TiAl by self-propagating high-temperature synthesis (SHS). The Ti, Al and C powders were applied in the joining process with the assisted electromagnetic field. The microstructure analysis revealed that a dark TiAl3 reaction layer existed at the interface. The TiC particles and multi-layer granular structures of the Ti–Al system were found in the reaction products. It was noted that the porosity was inevitable in direct SHS joining. In order to improve the joining quality, Ag-based brazing foil was inserted between the powder compacts and the TiAl substrate. Molten brazing alloy during SHS reaction improved the wettability of the interlayer to TiAl substrate and filled well into the holes in the reaction products. With the application of Ag-based brazing alloy, the density increased and the joining quality improved.

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Acknowledgements

The authors gratefully acknowledge the financial support from National Science Foundation of China, under the grant 50325517.

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Authors and Affiliations

  1. State Key Lab of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin, 150001, People’s Republic of China

    J. Cao, J. C. Feng & Z. R. Li

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  1. J. Cao
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  2. J. C. Feng
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  3. Z. R. Li
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Correspondence to J. Cao.

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Cao, J., Feng, J.C. & Li, Z.R. Joining of TiAl intermetallic by self-propagating high-temperature synthesis. J Mater Sci 41, 4720–4724 (2006). https://doi.org/10.1007/s10853-006-0061-4

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  • DOI: https://doi.org/10.1007/s10853-006-0061-4

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