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Journal of Materials Science

, Volume 40, Issue 17, pp 4483–4487 | Cite as

Kinetic equation describing the annealing process of copper

  • M. Segarra
  • M. Martínez
  • M. A. Fernández
  • J. M. Chimenos
  • F. Espiell
  • N. Sirvent
  • O. Guixà
Article

Abstract

During the annealing process of cold-drawn copper with small amounts of impurities a multiple-sigmoidal behavior has been found, related to the overlapping of two or more process steps, corresponding to a simultaneous recrystallization of the copper matrix and the impurities placement processes. A kinetic equation is introduced to describe the overall process by means of an auto-catalytic kinetic model which could also be extended to describe any annealing process presenting a multi-sigmoidal character.

Keywords

Polymer Copper Recrystallization Kinetic Model Kinetic Equation 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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Copyright information

© Springer Science + Business Media, Inc. 2005

Authors and Affiliations

  • M. Segarra
    • 1
  • M. Martínez
    • 1
  • M. A. Fernández
    • 1
  • J. M. Chimenos
    • 1
  • F. Espiell
    • 1
  • N. Sirvent
    • 2
  • O. Guixà
    • 2
  1. 1.Department of Chemical Engineering and MetallurgyUniversity of BarcelonaBarcelonaSpain
  2. 2.La Farga Lacambra, S. A., Colonia LacambraBarcelonaSpain

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