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Sequential deposition of copper/alumina composites

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Correspondence to E. A. Olevsky.

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Wang, X., Ma, J., Maximenko, A. et al. Sequential deposition of copper/alumina composites. J Mater Sci 40, 3293–3295 (2005). https://doi.org/10.1007/s10853-005-2704-2

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  • DOI: https://doi.org/10.1007/s10853-005-2704-2

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