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Journal of Materials Science

, Volume 40, Issue 13, pp 3361–3366 | Cite as

Power law indentation creep of Sn-5% Sb solder alloy

  • A. R. Geranmayeh
  • R. MahmudiEmail author
Article

Abstract

Creep behavior of the lead-free Sn-5%Sb solder alloy was studied by long time Vickers indentation testing at room temperature. Based on the steady-state power law creep relationship, the stress exponents were determined for the cast and wrought materials in the homogenized and unhomogenized conditions. The stress exponent values of 4.5 and 12, depending on the processing route of the material, are in good agreement with those reported for the same material in conventional creep testing at room temperature. The results are discussed on the basis of the microstructural features developed during different processing routes of the material.

Keywords

Polymer Microstructural Feature Creep Testing Creep Behavior Stress Exponent 
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Copyright information

© Springer Science + Business Media, Inc. 2005

Authors and Affiliations

  1. 1.Department of Mechanical EngineeringAzad UniversityTehranIran
  2. 2.Department of Metallurgical and Materials Engineering, Faculty of EngineeringUniversity of TehranTehranIran

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