With the rapid advancement of cyber-physical systems, Digital Twin (DT) is gaining ever-increasing attention owing to its great capabilities to realize Industry 4.0. Enterprises from different fields are taking advantage of its ability to simulate real-time working conditions and perform intelligent decision-making, where a cost-effective solution can be readily delivered to meet individual stakeholder demands. As a hot topic, many approaches have been designed and implemented to date. However, most approaches today lack a comprehensive review to examine DT benefits by considering both engineering product lifecycle management and business innovation as a whole. To fill this gap, this work conducts a state-of-the art survey of DT by selecting 123 representative items together with 22 supplementary works to address those two perspectives, while considering technical aspects as a fundamental. The systematic review further identifies eight future perspectives for DT, including modular DT, modeling consistency and accuracy, incorporation of Big Data analytics in DT models, DT simulation improvements, VR integration into DT, expansion of DT domains, efficient mapping of cyber-physical data and cloud/edge computing integration. This work sets out to be a guide to the status of DT development and application in today’s academic and industrial environment.
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Advanced message queuing protocol
Constrained application protocol
Cyber physical systems
Design failure mode and effects analysis
Enterprise resource planning
Finite element method
Laboratory virtual instrument engineering workbench
Manufacturing execution system
Message queuing telemetry transport
Network time protocol
Open motion planning library
- OPC UA:
Open platform communication unified architecture
Open systems interconnection
Prognostics and health management
Programmable logic controller
Product lifecycle management
Precision time protocol
- RAMI 4.0:
Reference architecture model Industry 4.0
Supervisory control and data acquisition
Simple hierarchical data representation
Simple object access protocol
Standard for exchange of product model data
Transmission control protocol/ internet protocol
User datagram protocol
Verification validation and accreditation
Wireless highway addressable remote transducer protocol
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The authors would like to acknowledge the financial support of the Start-up Fund for New Recruits (1-BE2X, Project ID: P0031040) from the Hong Kong Polytechnic University, Hong Kong, and the National Research Foundation (NRF) Singapore under the Corporate Laboratory @ University Scheme (Ref. RCA-16/434; SCORP1) at Nanyang Technological University, Singapore.
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Lim, K.Y.H., Zheng, P. & Chen, CH. A state-of-the-art survey of Digital Twin: techniques, engineering product lifecycle management and business innovation perspectives. J Intell Manuf 31, 1313–1337 (2020). https://doi.org/10.1007/s10845-019-01512-w
- Digital Twin
- Cyber-physical system
- Business model
- Product lifecycle management