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A Layout-Based Rad-Hard DICE Flip-Flop Design

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Abstract

The DICE flip-flop has been rendered ineffective in deep-submicron technology nodes (e.g. 65 nm and 28 nm) due to charge sharing when exposed to single event strikes. This paper presents a new single event upset tolerant flip-flop design by applying the hardening technique on DICE at the layout level. This approach is an alternative to existing Layout Design through Error-Aware Transistor Positioning (LEAP); it also re-places transistors in master and slave DICE latches in the zigzag fashion in the layout. Both computer simulations and heavy-ion experimental results demonstrate that our proposed layout design has no single event upset errors under normal strikes until LET = 37 MeV·cm2/mg compared to the traditional DICE structure.

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Acknowledgments

This work is supported by the Fundamental Research Funds for the Central Universities (2016B07414 & 2018B49614) and by the opening fund of Key Laboratory of Silicon Device Technology, Chinese Academy of Sciences. It is also supported through Innovation Foundation of Radiation Application, China Institute of Atomic Energy under contract No. KFZC2018040205.

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Correspondence to Haibin Wang.

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Wang, H., Dai, X., Ibrahim, Y.M.Y. et al. A Layout-Based Rad-Hard DICE Flip-Flop Design. J Electron Test 35, 111–117 (2019). https://doi.org/10.1007/s10836-019-05773-4

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  • DOI: https://doi.org/10.1007/s10836-019-05773-4

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