Journal of Electronic Testing

, Volume 28, Issue 6, pp 857–863 | Cite as

Current State of the Mixed-Signal Test Bus 1149.4

  • Jari Hannu
  • Juha Häkkinen
  • Juha-Veikko Voutilainen
  • Heli Jantunen
  • Markku Moilanen


This paper presents the current state of the IEEE standard for a Mixed-Signal Test Bus 1149.4 and examines proposed modifications and alternatives. The standard was published in 2001 and got its first major update in 2011 which included description language support. Although the standard has not gained high usage in the electronics manufacturing industry, research has been undertaken to improve its usability. The main research topic has been the test methods for discrete components and analog circuits but the usage of the analog test environment for various applications has also been considered. The proposed modifications for 1149.4 aim to exceed the current limitations of the standard such as the inability to perform RF testing or to access problems in multichip packages. The alternatives for the standard are examined, focusing on other testability standards and also emerging standards such as IJTAG. The alternative test methods and standards cannot directly replace the 1149.4, especially on board level mixed-signal testing.


Mixed signal testing 1149.4 Boundary scan 



The authors would like to thank Mick Austin from JTAG for the useful email discussions about the current state of 1149.4 in industrial applications.


  1. 1.
    Anonymous (2003) IEEE Standard for boundary-scan testing of advanced digital networks. IEEE Std 1149.6-2003 0_1-132Google Scholar
  2. 2.
    Anonymous (2010) IEEE Standard for reduced-pin and enhanced-functionality test access port and boundary-scan architecture. IEEE Std 1149.7-2009 c1-985Google Scholar
  3. 3.
    Anonymous (2011) IEEE standard for a mixed-signal test bus. IEEE Std 1149.4-2010 (Revision of IEEE Std 1149.4-1999) 1-116Google Scholar
  4. 4.
    Anonymous (2012) IEEE Draft standard for boundary-scan-based stimulus of interconnections to passive and/or active components. IEEE P1149.8.1/D5.2, November 2011 1-91Google Scholar
  5. 5.
    da Silva JM, Laramjeira LC, Matos JS (1999) A method for testing analog clusters using IEEE P1149.4. 125-126Google Scholar
  6. 6.
    Dejanovic S, Persson U et al (2005) Measurement of electrical parameters using mixed-signal test bus, IEEE Std. 1149.4. Measurement 37:260–277CrossRefGoogle Scholar
  7. 7.
    Duzevik I (2002) Preliminary results of passive component measurement methods using an IEEE 1149.4 Compliant Device. 1-10Google Scholar
  8. 8.
    Felgueiras MC, Alves GR, Martins Ferreira JM (2011) An embedded 1149.4 extension to support mixed-signal debugging. Microelectron J 42:218–232CrossRefGoogle Scholar
  9. 9.
  10. 10.
    Hakkinen J, Hannu J et al (2006) Embedded high-frequency analogue boundary scan test solution for a 900 MHz direct coversion I/Q transmitter. 105-104Google Scholar
  11. 11.
    Hakkinen J, Syri P et al (2004) A frequency mixing and sub-sampling based RF-measurement apparatus for IEEE 1149.4. Proceedings—International Test Conference 551-559Google Scholar
  12. 12.
    Hannu J, Happonen T and Moilanen M (2007) Embedded test controller for board and system level remote testing. Proceedings—International Mixed Signals Testing Workshop 88-92Google Scholar
  13. 13.
    Hannu J, Moilanen M (2007) Methods of testing discrete semiconductors in the 1149.4 environment. J Electron Test Theory Appl (JETTA) 23:581–592CrossRefGoogle Scholar
  14. 14.
    Hannu J, Saikkonen T et al (2010) Enabling remote testing: embedded test controller and mixed-signal test architecture. J Electron Test 26:641–658CrossRefGoogle Scholar
  15. 15.
    Hird K, Parker KP, Follis B (2002) Test coverage: what does it mean when a board test passes? Test Conference, 2002. Proceedings. International 1066-1074Google Scholar
  16. 16.
  17. 17.
    Jeffrey C, Cutajar R et al (2005) The integration of on-line monitoring and reconfiguration functions using IEEE1149.4 into a safety critical automotive electronic control unit. Proceedings-Design, Automation and Test in Europe, DATE ’05 153-158Google Scholar
  18. 18.
    JTAG, Mixed-Signal Boundary-Scan Evaluation System [online]
  19. 19.
    Kac U, Novak F et al (2000) Alternative test methods using IEEE 1149.4. Design, automation and test in Europe Conference and Exhibition 2000. Proceedings 463-467Google Scholar
  20. 20.
    Kac U, Novak F et al (2003) Extending IEEE Std. 1149.4 analog boundary modules to enhance mixed-signal test. Des Test Comput, IEEE 20:32–39CrossRefGoogle Scholar
  21. 21.
    Li Y, Lei J (2009) Design of analog test hardware platform based on IEEE 1149.4. Electronic Measurement & Instruments, 2009. ICEMI ’09. 9th International Conference on 1-873-1-876Google Scholar
  22. 22.
    Lin C-Y, Fang W-C et al (2011) A low noise and robust 3D system-in-package test scheme for highly integrated biomedical systems. Life Science Systems and Applications Workshop (LiSSA), 2011 IEEE/NIH 9-13Google Scholar
  23. 23.
    Matsushita Electric Industrial Co., LTD., MNABST-1 Data Sheet [online]
  24. 24.
    Poster IEEE 1149.4 Standard for a Mixed-Signal Test Bus [online]
  25. 25.
    Saikkonen T, Moilanen M (2007) Component value calculations and characterizations for measurements in the IEEE 1149.4 environment. J Electron Test Theory Appl (JETTA) 23:569–579CrossRefGoogle Scholar
  26. 26.
    Saikkonen T, Voutilainen J, Moilanen M (2003) Some methods to calculate the values of passive components from the measurements made with an 1149.4 compliant device. 1-10Google Scholar
  27. 27.
    Saikkonen T, Voutilainen J, Moilanen M (2004) Calculating the values of passive components in 1149.4 environment. 1-10Google Scholar
  28. 28.
    Sundar S, Kim B C et al (2007) Low cost automatic mixed-signal board test using IEEE 1149.4. Test Conference, 2007. ITC 2007. IEEE International 1-9Google Scholar
  29. 29.
    Sunter S, Filliter K et al (2001) A general purpose 1149.4 IC with HF analog test capabilities. Test Conference, 2001. Proceedings. International 38-45Google Scholar
  30. 30.
    Sunter S, Roy A (2011) A mixed-signal test bus and analog BIST with ‘unlimited’ time and voltage resolution. European Test Symposium (ETS), 2011 16th IEEE 81-86Google Scholar
  31. 31.
    Syri P, Hakkinen J, Moilanen M (2005) IEEE 1149.4 compatible ABMs for basic RF measurements. Proceedings—Design, Automation and Test in Europe, DATE ’05 172-173Google Scholar
  32. 32.
    The Artemis Chip Data Sheet [online]
  33. 33.
    Voutilainen J, Putaala J et al (2009) A prognostic method for the embedded failure monitoring of solder interconnections with 1149.4 test bus architecture. Microelectron J 40:1069–1080CrossRefGoogle Scholar
  34. 34.
    Zivkovic V A, van der Heyden F et al (2008) Analog test bus infrastructure for RF/AMS modules in core-based design. Test Symposium, 2008 13th European 27-32Google Scholar

Copyright information

© Springer Science+Business Media New York 2012

Authors and Affiliations

  • Jari Hannu
    • 1
  • Juha Häkkinen
    • 2
  • Juha-Veikko Voutilainen
    • 2
  • Heli Jantunen
    • 1
  • Markku Moilanen
    • 2
  1. 1.Microelectronics and Materials Physics LaboratoriesUniversity of OuluOuluFinland
  2. 2.Optoelectronics and Measurement Techniques LaboratoryUniversity of OuluOuluFinland

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