On the Use of Static Temperature Measurements as Process Variation Observable
In this paper we present the use of static temperature measurements as process variation observable. Contrary to previously published thermal testing methods, the proposed methodology does not need an excitation signal, thus reducing test cost and improving built-in capabilities of thermal monitoring. The feasibility of the technique and a complete test methodology is presented using a narrowband LNA as example. Finally, a complete electro-thermal co-simulation test bench between the LNA and a differential temperature sensor embedded in the same silicon die is presented in order to validate the results. Results prove that RF figures of merit can be extracted from DC temperature measurements done without loading or exciting the RF circuit under test.
KeywordsCMOS process variation RF built-in test Thermal monitoring RF thermal testing Design for manufacturability
This work was supported by project ENIAC MODERN (Spanish MICINN PLE2009-0024) and TERASYSTEMS TEC2008-01856. D. Gómez acknowledges the support of an AGAUR FI2009 scholarship.
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