Thermal and mechanical properties of lead-free transparent dielectric materials for plasma display panels
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The transparent dielectric materials for front panel in PDPs require good thermal expansion matching to glass substrate. Lead oxide (PbO) has been broadly utilized in transparent dielectric layers for low-temperature firing process. According to environmental and human health problem, however, Pb-based glass ceramics are no longer suitable for transparent dielectric layers. Glass with the Bi-based system was examined as a potential replacement for Pb-based glass. Softening point and coefficient of thermal expansion of the glass were at 520∘C and 8.5 × 10− 6/ ∘C, respectively. Optimum sintering temperature for the highest densification was at 560∘C, which indicated the highest flexural strength value derived from the lowest pore volume fraction. In addition, transmittance of specimen sintered at 560∘C was about 90% in a visible light region. These results suggested that Bi-based glass would be suitable as an alternative to Pb-based dielectric layer in PDPs.
KeywordsTransparent dielectric materials Lead-free Thermal property Mechanical property Plasma display panels
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