Abstract
A non-cyanide rose golden electroplating system was investigated in this work. The electroplated layer of Cu–Zn–Sn alloy was also investigated using a disodium ethylenediamine tetraacetate (EDTA·2Na) system, in which CuSO4·5H2O, ZnSO4·7H2O and Na2SnO3·3H2O were the main salts. EDTA·2Na acted as a complexing agent. Finally, NaOH acted as a buffering agent in the electroplating solution. The effects of different electroplating solutions on colour, micro-topography, composition and phase structure of the electroplated layer was analysed by photo analysis, SEM, EDS and XRD. Meanwhile, different electroplating solutions were analysed and compared by electrochemical analysis and UV–Vis, FTIR and NMR spectroscopy. A rose golden electroplated layer of Cu–Zn–Sn alloy could be obtained by adjusting the amount of the main salts. The composition of the electroplated layer was 98.81% Cu, 0.77% Zn and 0.42% Sn. Moreover, the electroplated layer was composed of regular 50–100 nm particles. The composition of the ternary alloy-electroplated layer was Cu, Cu5Zn8 and Cu10Sn3 phase. At the same time, the cathode only had a single deposition peak at − 1.22 V by electrochemical analysis of the electroplating solution. UV, IR and NMR analyses show that a chelate was formed with EDTA·2Na and metal ions in an alkaline environment. These results may provide a theoretical guidance for a new technology for Cu–Zn–Sn alloy electrodeposition.
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References
Abbott AP, Frisch G, Ryder KS (2013) Annu Rev Mater Res 43:335–358
Chu Q, Liang J, Hao J (2014) Electrochimica Acta 115:499–503
Vreese PD, Skoczylas A, Matthijs E, Fransaer E, Binnemans K (2013) Electrochimica Acta 108:788–794
Hrussanova A, Krastev I, Beck G, Zielonka A (2010) J Appl Electrochem 40:2145–2151
Qiao X, Li H, Zhao W, Li Q (2013) Electrochimica Acta 89:771–777
Gougaud C, Rai D, Delbos S, Chassaing E, Lincot D (2013) J Electrochem Soc 160:D485–D494
Joi A, Akolkar R, Landau U (2013) J Electrochem Soc 160:D3001–D3003
Almeida MRHD, Barbano EP, Carvalho MFD, Tulio PC, Carlos IA (2015) Appl Surf Sci 333:13–22
Clauwaert K, Binnemans K, Matthijs E, Fransaer J (2016) Electrochimica Acta 188:344–355
Ding LF, Liu F, Cheng J, Niu YL (2018) J Appl Electrochem 48:175–185
Slupska M, Ozga P (2014) Electrochimica Acta 141:149–160
Salhi Y, Cherrouf S, Cherkaoui M, Abdelouahdi K (2016) Appl Surf Sci 367:64–69
Almeida MRHD, Barbano EP, Zacarin MG, Brito MMD, Tulio PC, Carlos IA (2016) Surf Coat Technol 287:103–112
Ramírez C, Calderón JA (2016) J Electroanal Chem 765:132–139
Pary P, Bengoa LN, Egli WA (2015) J Electrochem Soc 162:D275–D282
Josell D, Moffat TP (2014) J Electrochem Soc 161:D558–D563
Almeida MRHD, Barbano EP, Carvalho MFD, Carlos IA, Siqueira JLP (2011) Surf Coat Technol 206:95–102
Ubale AU, Sakhare YS, Bombatkar SM (2013) Mater Res Bull 48:3564–3571
He Y, Gao X, Zhang Y, Xu H (2012) Surf Coat Technol 206:4310–4315
Banica R, Nyari T, Sasca V (2012) Int J Hydrogen Energy 37:16489–16497
Darban AK, Aazami M, Meléndez AM, Abdollahy M, Gonzalez I (2011) Hydrometallurgy 105:296–303
Yin KB, Xia YD, Chan CY, Zhang WQ, Wang QJ, Zhao XN, Li AD, Liu ZG, Bayes MW, Yee KW (2008) Scr Mater 58:65–68
Joint Committee on Powder Diffraction Standards. JCPDS, powder diffraction file—PDF-2, database sets 1-49, ICDD, 2000 (CDROM)
Murase K, Yanase K, Ichii T, Sugimura H (2010) J Electrochem Soc 160:515–521
Chen Z, Lei H, Lei W, Zhang C, Niu H (2011) Appl Surf Sci 257:8490–8492
Feng Z, Li Q, Zhang J, Yang P (2015) J Electrochem Soc 162:D412–D422
Tułodziecki M, Guery C, Taberna PL, Tarascon JM (2012) J Electrochem Soc 159:D691
Murase K, Ito A, Ichii T, Sugimura H (2011) J Electrochem Soc 158:D335–D698
Yu TY, Lee H, Hsu HL, Dow WP, Cheng HK (2016) J Electrochem Soc 163:D734–D741
Juškėnas R, Mockus Z, Kanapeckaitė S, Stalnionis G, Survila A (2017) Electrochimica Acta 52:928–935
Carvalho MFD, Barbano EP, Carlos IA (2013) Electrochimica Acta 109:798–808
Carvalho MFD, Barbano EP, Carlos IA (2015) Surf Coat Technol 262:111–122
Zhao X, Zhang J, Qu J (2015) Electrochimica Acta 180:129–137
Schah-Mohammedi P, Shenderovich IG, Detering C, Limbach H, Tolstoy PM, Smirnov SN, Denisov GS, Golubev NS (2013) J Electrochem Soc 122:12878–12879
Jiang L, Huang J, Wang Y, Tang H (2012) Analyst 137:4209–4219
He H, Wu D, Zhao L, Luo C, Dai C, Zhang Y (2016) J Hazard Mater 309:116–125
Guan X, Jiang X, Qiao J, Zhou G (2015) J Hazard Mater 300:688–694
Cui L, Wang Y, Gao L, Hu L, Yan L, Wei Q (2015) Chem Eng J 281:1–10
Zhao M, Yu L, Akolkar R, Anderson AB (2016) J Phys Chem 120:24789–24793
Zhang Z, Fu Y, Zhou C, Li J, Lai Y (2015) Solid State Ion 269:62–66
Kržišnik N, Mladenovič A, Škapin AS, Škrlep L, Ščančar J, Milačič R (2014) Sci Total Environ 476:20–28
Garapati S, Burns CS, Rodriguez A (2014) J Phys Chem B 118:12960–12964
Liu F, Shan C, Zhang X, Zhang Y, Zhang W (2017) J Hazard Mater 321:290–298
Acknowledgements
This work was supported by the National Natural Science Foundation of China (Grant No. NSFC51604180), the Applied Basic Research Programs of Science and Technology Department of Shanxi Province (Grant No. 201701D221036), the start-up funds of Taiyuan Institute of Technology, and the Youth Academic Leader of Taiyuan Institute of Technology support program.
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Ding, L., Chen, C., Dong, Y. et al. Theory and technology for electroplating a rose golden Cu–Zn–Sn alloy using a disodium ethylenediamine tetraacetate system. J Appl Electrochem 49, 715–729 (2019). https://doi.org/10.1007/s10800-019-01316-z
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DOI: https://doi.org/10.1007/s10800-019-01316-z