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Rapid screening of plating additives for bottom-up metallization of nano-scale features

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Abstract

An improved test for rapid determination of the efficacy of additives systems for use in bottom-up copper metallization of micro- and nano-scale features is introduced as a replacement for the classical injection technique. The conventional injection test is based on measuring the polarization response to the injection of an additive into a solution in which a rotating disk electrode is plated at a moderate constant current density of about 10 mA cm−2. The inaccurate assumptions underlying this test and its limitations are discussed. The modified screening technique introduced here is based on the recognition that bottom-up metallization of micro- and nano-scale features is carried out at a constant overpotential where the current density at the inhibited regions of the feature is significantly lower, on the order of 1 mA cm−2. A single polarization measurement at this low current density in an electrolyte containing the tested suppressors is suggested. The suppressors exhibiting the largest overpotentials are considered promising and should be selected for further characterization.

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Abbreviations

E :

Standard potential

F :

Faraday’s constant

i :

Current density

\(i_{\text{B}}\) :

Current density at feature bottom

\(i_{\text{L}}\) :

Limiting current density

\(i_{\text{T}}\) :

Current density at feature rim and top of wafer

L :

Feature depth

n :

Number of electrons transferred

r :

Radius of working electrode

R :

Feature radius

R g :

Universal gas constant

T :

Temperature

V :

Applied potential

\(\eta_{\text{a}}\) :

Activation overpotential

\(\eta_{\text{c}}\) :

Concentration overpotential

\(\eta_{\varOmega}\) :

Ohmic overpotential

\(\eta_{\text{B}}\) :

Overpotential at feature bottom

\(\eta_{\text{T}}\) :

Overpotential at feature rim and top surface

κ :

Electrolyte conductivity

Φ:

Electrostatic potential in solution

ΦB :

Electrostatic potential in solution at feature bottom

ΦT :

Electrostatic potential in solution at feature top

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Acknowledgments

The authors gratefully acknowledge support from Atotech for this work. Coupon plating studies were assisted by Jun Wu (Atotech).

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Authors and Affiliations

  1. Department of Chemical and Biomolecular Engineering, Case Western Reserve University, Cleveland, OH, 44106, USA

    Lindsay Boehme & Uziel Landau

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  1. Lindsay Boehme
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  2. Uziel Landau
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Correspondence to Uziel Landau.

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Boehme, L., Landau, U. Rapid screening of plating additives for bottom-up metallization of nano-scale features. J Appl Electrochem 46, 39–46 (2016). https://doi.org/10.1007/s10800-015-0873-5

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