Inhibition effect of some aromatic amines on copper electrodeposition from acidic baths
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To improve the quality requirements for copper deposits, the influence of some inhibition agents added to the acidic copper bath has been studied. Several aromatic nitrogen compounds have been tested as inhibition agents, such as aniline, N-methylaniline, N-ethylaniline, N,N-dimethylaniline (DMA), and N,N-diethylaniline (DEA). The electrochemical behavior of these organic additives and the most relevant aspects of the electrochemical behavior of copper in acid solutions have been analyzed by cyclic voltammetry. At the same time, a correlation between voltammetric data and molecular properties of protonated amines obtained by molecular modeling has been performed. The morphology of the copper deposits obtained in the absence and presence of organic compounds has been studied by scanning electron microscopy. An improvement of the roughness degree and crystallite size upon addition of aromatic amine has been found. Best results were obtained for DMA and DEA working at room temperature (25 ± 0.1 °C) and 200 A m−2 current density, in 1 mol L−1 sulfuric acid solution with 50 g L−1 Cu2+.
KeywordsAcid copper bath Inhibition agents Aromatic amines Molecular modeling
This study was partially supported by the strategic grant POSDRU/88/1.5/S/50783, Project ID50783 (2009), co-financed by the European Social Fund–Investing in People, within the Sectoral Operational Programme Human Resources Development 2007–2013 and partially supported by the grant POSDRU 21/1.5/G/13798 inside POSDRU Romania 2007–2013 co-financed by the European Social Fund–Investing in People.
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