A quartz crystal microbalance study of the kinetics of interaction of benzotriazole with copper
- 117 Downloads
The kinetics of interaction of benzotriazole (C6H5N3, BTAH) with the surface of copper in salt water were studied using an electrochemical quartz crystal microbalance and X-ray photoelectron spectroscopy (XPS). Upon injecting BTAH into the electrolyte, three regions appear in the time response of the microbalance. Region I (at short time of few minutes), exhibits rapid linear growth of mass with time, which is attributed to the formation of a protective Cu(I)BTA complex. Region II reveals attachment of BTAH at a slower rate onto the inner Cu(I)BTA complex. Region III is a plateau indicating that the BTAH film attains an equilibrium mass and thickness, which increase with the concentration of BTAH. The intensity of the N1s peak in the XPS spectra increases with the time of immersion, indicating more BTAH on the surface. The results suggest a duplex inhibitor film composed of an inner thin layer of Cu(I)BTA and an outer layer of physically adsorbed BTAH which increases in thickness with time and BTAH concentration. They also offer an explanation for the much documented findings of simultaneous increase of the polarization resistance and decrease of double layer capacity with inhibitor concentration and time of immersion.
KeywordsBenzotriazole Copper Corrosion inhibitor Duplex film Quartz crystal microbalance
The authors gratefully acknowledge support of this work by the Research Administration of Kuwait University, under Grant Numbers SC03/02 and GS01/01.
- 3.Cotton JB, Scholes IR (1967) Br Corros J London 2(1):1Google Scholar
- 14.Jin-Hua C, Zhi-Cheng L, Shu C, Li-Hua N, Shou-Zhuo Y (1997) Electrochim Acta 43(3, 4):265Google Scholar
- 23.Deshpande S, Kuiry SC, Klimov M, Obeng Y, Seal S (2004) J Electrochem Soc 151(11):G788; S. Deshpande, Kuiry SC, Klimov M, Seal S (2005) J Electrochem Solid St 8(4):G98Google Scholar
- 24.Li XJ, Guo DM, Ren RK, Jin ZJ (2006) In: Cai G, Xu X, Kang R (eds) Advances in grinding and abrasive technology XIII, key engineering materials, vol 304, 305. Trans Tech Publications, Switzerland, pp 350–354Google Scholar
- 27.Sayed SY, El-Deab MS, El-Anadouli BE, Ateya BG (2003) J Phys Chem 107(23):5575Google Scholar
- 36.Mansfield F, Smith T, Parry ET (1971) Corrosion 28(7):289Google Scholar