Journal of Applied Electrochemistry

, Volume 37, Issue 5, pp 575–582 | Cite as

Electrodeposition of copper–magnetite magnetic composite films

Original Paper


Electrodeposition was demonstrated to be useful for the preparation of copper–magnetite magnetic composites. An acidic bath was tested for the incorporation of nanometric magnetite (Fe3O4) particles into an electrodeposited copper matrix. Cationic surfactant (dodecyltrimethylammonium chloride—DTAC) was used to keep particles suspended in the electrolyte as well as to assist magnetite incorporation. The influence of several parameters (bath temperature, deposition technique, stirring regimes and deposition conditions) on composites composition was analysed. Low stirring rate, moderate temperature (15 °C) and an applied magnetic field provided a greater incorporation of magnetite. Field emission scanning electron microscopy revealed magnetite distribution through the deposit thickness. Electrodeposited composites showed ferromagnetic behaviour. Magnetic force microscopy showed a magnetic response for the composites.


Composite Electrodeposition Magnetic properties Copper Magnetite 



The authors thank Josep M. Montero-Moreno, the Serveis Cientificotècnics (Universitat de Barcelona), and the Servei de Magnetoquímica (Universitat de Barcelona) for the use of their equipment. This paper was supported by contract MAT 2003-09483-C02-01 from the Comisión Interministerial de Ciencia y Tecnología (CICYT).


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Copyright information

© Springer Science+Business Media, Inc. 2007

Authors and Affiliations

  1. 1.Electrodep, Departament de Química Física and Institut de Nanociència i NanotecnologiaUniversitat de BarcelonaBarcelonaSpain

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