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International Journal of Thermophysics

, Volume 28, Issue 2, pp 723–731 | Cite as

Liquid–Liquid Interfacial Tension in Ternary Monotectic Alloys Al–Bi–Cu and Al–Bi–Si

  • I. Kaban
  • W. Hoyer
  • M. Kehr
Article

The liquid–liquid interfacial tension in the ternary monotectic alloys Al34.5-x Bi65.5Cu x and (Al0.345Bi0.655)100-x Si x (mass%) has been determined as a function of its Cu (Si) content by a tensiometric technique. It is established that the interfacial tension gradually increases when either Cu or Si is added to Al–Bi alloys. The increase of \(\sigma_{\alpha \beta}\) can be related to the increase of the miscibility gap (both width and height) when Cu (Si) is added to the Al–Bi binary. The temperature dependences of the interfacial tension in binary Al34.5Bi65.5 and ternary Al23.25Bi65.5Cu11.25 and (Al0.345Bi0.655)95Si5 monotectic alloys are well described by the power function \(\sigma_{\alpha \beta}=\sigma_{0}\cdot(1-T/T_{\rm C})^{\mu}\) with the critical-point exponent \(\mu=1.3\).

Keywords

aluminum bismuth copper immiscibility interfacial tension silicon 

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Copyright information

© Springer Science+Business Media, LLC 2007

Authors and Affiliations

  1. 1.Institute of PhysicsChemnitz University of TechnologyChemnitzGermany

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