BROAD-BAND VERTICAL INTERCONNECT BETWEEN MULTILAYER MODULES USING DOUBLE CURRENT PROBES
A novel vertical interconnect scheme between highly integrated multilayer low temperature co-fired ceramic (LTCC) modules has been proposed in this paper. Substrate integrated waveguide (SIW) is manufactured in LTCC substrate and microwave solder-less connector based on the fuzz button technology is used to realize reliable and effective interconnection. The proposed scheme makes use of double current probes to transfer energy between two substrates. Two forms of this interconnect are demonstrated, and simulated bandwidth more than 30% by using 15dB return-loss reference, insertion loss is less than 0.5dB over the passband.
Key Wordssolder-less vertical interconnect LTCC millimeter wave SIW
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- David carter, ’’fuzz button’ interconnects at microwave and mm-wave frequency.’ Packaging and Interconnects at Microwave and mm-Wave Frequencies, IEE Seminar, pp.3/1–3/6, 2000Google Scholar
- Rick Sturdivant, Chung Ly, Joe Benson, Mark Hauhe, ’Design and performance of a high density 3D microwave module.” Microwave Symposium Digest, IEEE MTT-S International, vol.2, pp.501–504, 1997Google Scholar
- Ke Wu, Dominic Deslandes, and Yves Cassivi, ’The Substrate Integrated Circuits — A New Concept for High-Frequency Electronics and Optoelectronics’, Telecommunications in Modern Satellite, Cable and Broadcasting Service, TELSIKS 2003. 6th International Conference, Vol.1, pp.P-III–P-X, 2003CrossRefGoogle Scholar
- A. Panter, C. Glaster, M.G. Stubbs, J.S. Wight, ’Vertical transitions in lowtemperature co-fired ceramics for LMDS’, IEEE MTT-S International, vol.3, pp.1907–1910, 2001Google Scholar