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BROAD-BAND VERTICAL INTERCONNECT BETWEEN MULTILAYER MODULES USING DOUBLE CURRENT PROBES

  • Lei Xia
  • Ruimin Xu
  • Bo Yan
Article

Abstract

A novel vertical interconnect scheme between highly integrated multilayer low temperature co-fired ceramic (LTCC) modules has been proposed in this paper. Substrate integrated waveguide (SIW) is manufactured in LTCC substrate and microwave solder-less connector based on the fuzz button technology is used to realize reliable and effective interconnection. The proposed scheme makes use of double current probes to transfer energy between two substrates. Two forms of this interconnect are demonstrated, and simulated bandwidth more than 30% by using 15dB return-loss reference, insertion loss is less than 0.5dB over the passband.

Key Words

solder-less vertical interconnect LTCC millimeter wave SIW 

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Copyright information

© Springer Science+Business Media, Inc. 2007

Authors and Affiliations

  1. 1.College of Electronic EngineeringUniversity of Electronic Science and Technology of ChinaChengduPeople’s Republic of China

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