Syntact Heat-Insulating Materials Based on Ceramic-Forming Organosilicon Binder
- 23 Downloads
The possibility of using hollow ceramic microspheres and an organosilicon binder with silane and carbosilane links to obtain heat-resistant heat-insulating foam ceramics for construction purposes is demonstrated. The effect of the filler and the gaseous medium on the products of thermal destruction and the properties of the composite is considered. The thermophysical and physicomechanical characteristics of the heat-insulating materials are specified.
KeywordsSilane Foam Gaseous Medium Thermal Destruction Construction Purpose
Unable to display preview. Download preview PDF.
- 1.V. Yu. Chukhlanov and E. P. Sysoev, “Use of hollow microspheres in organosilicon syntact foam materials, ” Steklo Keram., No. 2, 11–12 (2000).Google Scholar
- 2.V. Bazhant, V. Khvalovski, and D. Radsuzki, Silicon [Russian translation], Khimiya, Moscow (1960).Google Scholar
- 3.V. Yu. Chukhlanov and A. N. Alekseenko, “Use of syntact foam plastics with organosilicon binders in construction,” Stroit. Mater., No. 6, 26–27 (2001).Google Scholar
- 4.M. T. Bryk, Destruction of Filled Polymers [in Russian], Khimiya, Moscow (1989).Google Scholar