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Glass and Ceramics

, Volume 62, Issue 5–6, pp 145–147 | Cite as

Syntact Heat-Insulating Materials Based on Ceramic-Forming Organosilicon Binder

  • V. Yu. Chukhlanov
  • E. P. Sysoev
  • E. N. Tereshina
Article
  • 23 Downloads

Abstract

The possibility of using hollow ceramic microspheres and an organosilicon binder with silane and carbosilane links to obtain heat-resistant heat-insulating foam ceramics for construction purposes is demonstrated. The effect of the filler and the gaseous medium on the products of thermal destruction and the properties of the composite is considered. The thermophysical and physicomechanical characteristics of the heat-insulating materials are specified.

Keywords

Silane Foam Gaseous Medium Thermal Destruction Construction Purpose 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

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REFERENCES

  1. 1.
    V. Yu. Chukhlanov and E. P. Sysoev, “Use of hollow microspheres in organosilicon syntact foam materials, ” Steklo Keram., No. 2, 11–12 (2000).Google Scholar
  2. 2.
    V. Bazhant, V. Khvalovski, and D. Radsuzki, Silicon [Russian translation], Khimiya, Moscow (1960).Google Scholar
  3. 3.
    V. Yu. Chukhlanov and A. N. Alekseenko, “Use of syntact foam plastics with organosilicon binders in construction,” Stroit. Mater., No. 6, 26–27 (2001).Google Scholar
  4. 4.
    M. T. Bryk, Destruction of Filled Polymers [in Russian], Khimiya, Moscow (1989).Google Scholar

Copyright information

© Springer Science+Business Media, Inc. 2005

Authors and Affiliations

  • V. Yu. Chukhlanov
    • 1
  • E. P. Sysoev
    • 1
  • E. N. Tereshina
    • 1
  1. 1.Vladimir State UniversityVladimirRussia

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