Abstract
The delamination of a circular thin film at micro/nanoscale is studied using the Kirchhoff plate theory incorporating surface effects in this paper. Bending of a clamped circular nanoplate subjected to a concentrated force at the center or a uniformly distributed force over a lateral surface is solved. The bending deflection is derived in closed form. The adhesion energy and its release rate for delamination are determined when surface effects are taken into account. The influences of surface residual stress and surface elasticity along with the film’s size on the energy release rate of debonding advance or interfacial adhesion of a thin film bonded to an elastic substrate are analyzed for applied loading or given displacements. Analytic results are compared with experimental data and satisfactory agreement is confirmed.
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Acknowledgements
This work was supported by the National Natural Science Foundation of China (No. 11672336) and the Open Foundation of State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, PRC (No. GZ1712).
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Yang, Y., Lee, K.Y. & Li, XF. Surface effects on delamination of a thin film bonded to an elastic substrate. Int J Fract 210, 81–94 (2018). https://doi.org/10.1007/s10704-018-0262-2
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DOI: https://doi.org/10.1007/s10704-018-0262-2