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Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness

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Abstract

A systematic investigation and characterization of the interfacial fracture toughness of the bi-material copper leadframe/epoxy molding compound is presented. Experiments and finite element simulations were used to investigate delamination and interfacial fracture toughness of the bi-material. Two dimensional simulations using virtual crack closure technique, virtual crack extension and J-integral proved to be computationally cheap and accurate to investigate and characterize the interfacial fracture toughness of bi-material structures. The effects of temperature, moisture diffusion and mode-mixity on the interfacial fracture toughness of the bi-material were considered. Testing temperature and moisture exposure significantly reduce the interfacial fracture toughness, and should be avoided if possible.

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Authors and Affiliations

  1. Department of Mechanical Engineering, University of South Florida, 4202 E. Fowler Ave ENB118, Tampa, FL, 33627, USA

    Hai T. Tran & Alex A. Volinsky

  2. Robert Bosch GmbH, Automotive Electronics, 70442 , Stuttgart, Germany

    M. Hossein Shirangi

  3. Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, 100083, China

    Xiaolu Pang

Authors
  1. Hai T. Tran
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  2. M. Hossein Shirangi
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  3. Xiaolu Pang
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  4. Alex A. Volinsky
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Correspondence to Alex A. Volinsky.

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Tran, H.T., Shirangi, M.H., Pang, X. et al. Temperature, moisture and mode-mixity effects on copper leadframe/EMC interfacial fracture toughness. Int J Fract 185, 115–127 (2014). https://doi.org/10.1007/s10704-013-9907-3

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  • DOI: https://doi.org/10.1007/s10704-013-9907-3

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