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Investigation on Bond-Slip Behavior of Z-Pin Interfaces in X-Cor® Sandwich Structures Using Z-Pin Pull-Out Test

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A Correction to this article was published on 29 September 2018

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Abstract

The Z-Pin interfacial bond properties play an important role in the structural performance of X-Cor® sandwich structures. This paper presents an experimental investigation on bond-slip behavior of Z-Pin interfaces using Z-Pin pull-out test. Based on the experimental data the whole Z-Pin pull-out process consists of three stages: initial bonding, debonding and frictional sliding. Comparative experimental study on the influence of design parameters on bond-slip behavior of Z-Pin interfaces has also been performed. Numerical analyses were conducted with the ABAQUS finite element (FE) program to simulate the Z-Pins bond-slip response of the pull-out test. The Z-Pins interfacial bond-slip behavior was implemented using nonlinear spring elements characterized with the constitutive relation from experimental results. Numerical results were validated by comparison with experimental data, and reasonably good agreement was achieved between experimental and analytical pull-out force-slip curves.

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  • 29 September 2018

    The original version of this article unfortunately contains mistakes. Below are the corrections: 1) In Equation 9, a “minus (-)” sign is missing in the second line and a “less-than or equal to (≤)” sign was captured in the third line instead of the correct “less than sign (<)”.

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Acknowledgements

The experimental data in this paper about Z-Pin pulled out from face sheets with a thickness of 3 mm are derived from reference [22]. -Experimental Study on Z-Pin Bridging Law by Pullout Test. Thanks again!

Funding

This study was supported by the Fundamental Research Funds for the Central Universities (NUAA NS2015099).

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Authors and Affiliations

  1. Key Laboratory of Small and Medium-Sized Unmanned Aerial Vehicle Advanced Technology, Ministry of Industry and Information Technology, Nanjing University of Aeronautics & Astronautics, Nanjing, China

    Hangying Shan

  2. College of Material Science and Technology, Nanjing University of Aeronautics & Astronautics, Nanjing, China

    Jun Xiao & Qiyi Chu

Authors
  1. Hangying Shan
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  2. Jun Xiao
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Correspondence to Hangying Shan.

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The author declared no potential conflicts of interest with respect to the research, authorship, and/or publication of this article.

Additional information

The original version of this article was revised: The original version of this article unfortunately contains mistakes. 1) In Equation 1, a “less-than or equal to (≤)” sign was captured in the third line instead of the correct “less than sign (<)”; 2) In Equation 9, a "minus (-)" sign is missing in the second line and a "less-than or equal to (≤)" sign was captured in the third line instead of the correct "less than sign (<)"; 3) Figures 6, 11, and 13 were not updated during the modification stage. The corrected data are now shown here.

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Shan, H., Xiao, J. & Chu, Q. Investigation on Bond-Slip Behavior of Z-Pin Interfaces in X-Cor® Sandwich Structures Using Z-Pin Pull-Out Test. Appl Compos Mater 26, 299–316 (2019). https://doi.org/10.1007/s10443-018-9693-1

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  • DOI: https://doi.org/10.1007/s10443-018-9693-1

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