Abstract
In the fracture problems of hydrophilic elastic materials under coupling effects of heat conduction, moisture diffusion and mechanical deformation, the conventional J-integral is no longer path independent. The value of J is unequal to the energy release rate in hygrothermal coupling cases. In the present paper, we derived a general form of the energy release rate for hygrothermal fracture problems of the hydrophilic elastic materials on the basis of energy balance equation in cracked areas. By introducing the constitutive relations and the essential equations of irreversible thermodynamics, a specific expression of the energy release rate was obtained, and the expression can be reformmulated as path independent integrals, which is equivalent to the energy release rate of the fracture body. The path independence of the integrals is then verified numerically.
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Nicolais L., Apicella A., Drioli E.: Effect of applied stress, thermal environment and water in epoxy resins. AFOSR-TR-82-0215, 1980
Henson M.C., Weitsman Y.: Stress effects on moisture transport in an epoxy resin and its composite. In: Kawabata K., Umekawa S., Kobayashi A. (eds) Composites '86: recent advances in japan and the united states, Proc. Japan-US CCM-III, Tokyo, Japan, 1986-06-24. Tokyo, Japan: Japan Society for Composite Materials, 775–783 (1986)
Park Y.B., Yu J.: Fracture mechanics analysis of the popcorn cracking in the plastic IC packages. In: Millard D (ed) Proceedings 21st IEEE CPMT International Electron. Manuf. Technol. IEMT Symp., Austin, TX, USA, 1997-10-13–15. Piscataway, NJ, USA: IEEE., 12–19 (1997)
Lim J.H., Lee K.W., Park S.S., Earmme Y.Y.: Vapor pressure analysis of popcorn cracking in plastic IC packages by fracture mechanics. In: Tay A.A.O., Lin T.B. (eds) Proceedings of the 1998 IEEE/CPMT 2nd Electronics Packaging Technology Conference (EPTC'98), Singapore, 1998-12-08–10. Piscataway, NJ, USA: IEEE. 36–42 (1998)
Tay A.A.O., Lin T.Y.: Impact of moisture diffusion during solder reflow on package reliability. In: Proc. Electron. Compon. Technol. Conf., San Diego, CA, USA, 1998-06-01–04. Piscataway, NJ, USA: IEEE. 830–836 (1999)
Griffith A.A.: The phenomena of rupture and flow in solids. Phil Tran Ser A 221, 163–189 (1920)
Irwin G.R.: Fracture dynamics. In: Fracturing of metals, Cleveland, OH, USA: ASM., 147–166 (1948)
Irwin G.R.: Onset of fast crack propagation in the high strength steel and aluminum alloys. In: Sagamore research conference proceedings, 2, 289–305 (1956)
Orowan E.: Fracture and strength of solids. Reports on Progress in Physics X11, 185–232 (1948)
Rice J.R.: A path independent integral and the approximate analysis of strain concentrations by notches and cracks. J Appl Mech 35, 379–386 (1968)
Wilson W.K., Yu I.-W.: The use of the J-integral in thermal stress crack problems. Int J Fract 15(4), 377–387 (1979)
Shih C.F., Moran B., Nakamura T.: Energy release rate along a three-dimensional crack front in a thermally stressed body. Int J Fract 30(2), 79–102 (1986)
Lin T.Y., Tay A.A.O.: A J-integral criterion for delamination of Bi-material interfaces incorporating hygrothermal stresses. In: Suhir E. (ed) ASME-EEP, Vol. 19, Advances in Electronic Packaging, Kohala Coast, HI, USA, 1997-06-15–19. NY, USA: ASME. 1421–1428 (1997)
Atluri S.N.: Structural integrity and durability. Tech. Science Press, Forsyth, GA, USA, 1997
Weitsman Y.: Stress assisted diffusion in elastic and viscoelastic materials. J Mech Phys Solids 35, 73–93 (1987)
Wang J., Yang F., Chen D.P.: Coupled viscoelastic constitutive relations involving thermal effect and moisture diffusion process. Acta Mechanica Sinica, 34(5), 735–742 (2002) (in Chinese)
Weitsman Y.: A continuum diffusion model for viscoelastic materials. J Phy Chem 94(2), 961–968 (1990)
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The project supported by the Key Project of Chinese Ministry of Education (03145) and the Science Fund of Southwest Jiaotong University.
The English text was polished by Yunming Chen.
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Yang, F., Wang, J. & Chen, D. The energy release rate for hygrothermal coupling elastic materials. ACTA MECH SINICA 22, 28–33 (2006). https://doi.org/10.1007/s10409-006-0087-5
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DOI: https://doi.org/10.1007/s10409-006-0087-5