Acta Mechanica Solida Sinica

, Volume 21, Issue 4, pp 318–326 | Cite as

Effect of Fabrication on High Cycle Fatigue Properties of Copper Thin Films

  • Jun-Hyub Park
  • Joong-Hyok An
  • Yun-Jae Kim
  • Hyeon-Chang Choi


The influence of fabrication on the tensile and fatigue behavior of copper films manufactured by 3 kinds of fabrication methods was investigated. The tensile and high cycle fatigue tests were performed using the test machine developed by authors. Young’s moduli (72, 71 and 69 GPa, respectively) are lower than the literature values (108–145 GPa), while the yield strengths were as high as 358, 350 and 346 MPa, respectively and the ultimate strengths as 462, 456 and 446 MPa, respectively. There is not much difference in the tensile properties of the 3 kinds of films. There is little difference in the fatigue properties of the 3 kinds of films but one of them has shorter fatigue life than others in high cycle region and longer fatigue life than others in low cycle region.

Key Words

mechanical properties thin film copper high cycle fatigue test 


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  1. [1]
    Spearing, S.M., Materials issues in microelectromechanical systems (MEMS). Acta Materialia, 2000, 48: 179–196.CrossRefGoogle Scholar
  2. [2]
    Nix, W.D., Mechanical properties of thin films. Metallurgical Transactions, 1989, 20(A): 2217–2245.CrossRefGoogle Scholar
  3. [3]
    Vinci, R.P. and Vlassak, J.J., Mechanical behavior of thin films. Annual Review Materials Science, 1996, 26: 431–462.CrossRefGoogle Scholar
  4. [4]
    Kraft, O. and Volkert, C.A., Mechanical testing of thin films and small Structures. Advanced Engineering Materials, 2001, 3(3): 99–110.CrossRefGoogle Scholar
  5. [5]
    Sharpe, W.N., Mechanical Properties of MEMS Materials, in The MEMS Handbook. CRC Press, 2001.Google Scholar
  6. [6]
    Kriese, M.D., Boismier, D.A., Moodyc, N.R. and Gerberich, W.W., Nanomechanical fracture-testing of thin films. Engineering Fracture Mechanics, 1998, 61: 1–20.CrossRefGoogle Scholar
  7. [7]
    Schweitz, J.A. and Ericson, E., Evaluation of mechanical materials properties by means of surface micromachined structures. Sensors and Actuators, 1999, 74: 126–133.CrossRefGoogle Scholar
  8. [8]
    Connolley, T., Mchugh, P.E., Bruzzi, M., A review of deformation and fatigue of metals at small size scale. Fatigue Fracture Engineering Material Structure, 2005, 28: 1119–1152.CrossRefGoogle Scholar
  9. [9]
    Srikar, V.T. and Spearing, S.M., A critical review of microscale mechanical testing methods used in the design of micromechanical systems. Experimental Mechanics, 2003, 43(3): 238–247.CrossRefGoogle Scholar
  10. [10]
    Park, J.H., Development of micromechanical testing machine and its application. IEEE Transactions on Components and Packaging Technologies, 2002, 25(2): 317–322.CrossRefGoogle Scholar
  11. [11]
    Read, D.T., Tension-tension fatigue of copper thin film. International Journal of Fatigue, 1998, 20(3): 203–209.CrossRefGoogle Scholar
  12. [12]
    Cheng, Y.W., Read, D.T., McColskey, J.D. and Wright, J.E., A tensile-testing technique for micrometer-sized free-standing thin films. Thin Solid Films, 2005, (484): 426–432.CrossRefGoogle Scholar
  13. [13]
    Park, J.H., Kim, C.Y., Choa, S.H., Lee, C.S., Che, W.S. and Song, J.H., New structures and techniques for easy axial loading test of static and fatigue properties of MEMS materials. Key Engineering Materials, 2005, (297–300): 545–550.CrossRefGoogle Scholar
  14. [14]
    Park, J.H., Kim, Y.J., Myung, M.S., Lee, C.S., Choa, S.H. and Choi, N.S., Novel test procedure of tensile test for MEMS materials. Key Engineering Materials, 2006, (321–323): 136–139.CrossRefGoogle Scholar
  15. [15]
    Park, J.H., An, J.H., Kim, Y.J., Huh, Y.H. and Lee, H.J., Tensile and high cycle fatigue test of copper thin film. Materialwissenschaft and Werkstofftechnik (Materials Science and Enginerring Technology), 2008, 39(2): 187–192.CrossRefGoogle Scholar
  16. [16]
    Gad-el-Hak M, et. al (ed.) MEMS Handbook. CRC press, 2005, 3–19.Google Scholar

Copyright information

© The Chinese Society of Theoretical and Applied Mechanics and Technology 2008

Authors and Affiliations

  • Jun-Hyub Park
    • 1
  • Joong-Hyok An
    • 2
  • Yun-Jae Kim
    • 2
  • Hyeon-Chang Choi
    • 1
  1. 1.Department of Mechatronics Engineering, College of EngineeringTongmyong UniversityBusanKorea
  2. 2.Department of Mechanical Engineering, College of EngineeringKorea UniversitySeoulKorea

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