Journal of Material Cycles and Waste Management

, Volume 20, Issue 1, pp 375–385 | Cite as

A study on recovery of SiC from silicon wafer cutting slurry

  • Wei-Hao Lee
  • Chih-Wei Hsu
  • Yung-Chin Ding
  • Ta-Wui Cheng


The objective of this study is to recover SiC from silicon wafer cutting slurry using physical separation and acid/alkali purification processes. Hydrocyclone was used in the first-stage process to recover SiC and Si from silicon wafer cutting slurry. Through hydrocyclone separation, the SiC content and recovery of can reach 98 and 88%, respectively. In acid and alkali purification processes, the iron and silicon can be removed and further increase the SiC content up to 99.5%. From the test results obtained in this study, it is believed that the recycling and reutilization of SiC from silicon wafer cutting slurry can be highly feasible and economical.


SiC Wafer Cutting slurry Hydrocyclone 


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Copyright information

© Springer Japan 2017

Authors and Affiliations

  • Wei-Hao Lee
    • 1
  • Chih-Wei Hsu
    • 2
  • Yung-Chin Ding
    • 1
  • Ta-Wui Cheng
    • 1
  1. 1.Institute of Mineral Resources EngineeringNational Taipei University of TechnologyTaipeiTaiwan, Republic of China
  2. 2.GlobalWafers Co., Ltd.HsinchuTaiwan, Republic of China

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