A study on recovery of SiC from silicon wafer cutting slurry
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The objective of this study is to recover SiC from silicon wafer cutting slurry using physical separation and acid/alkali purification processes. Hydrocyclone was used in the first-stage process to recover SiC and Si from silicon wafer cutting slurry. Through hydrocyclone separation, the SiC content and recovery of can reach 98 and 88%, respectively. In acid and alkali purification processes, the iron and silicon can be removed and further increase the SiC content up to 99.5%. From the test results obtained in this study, it is believed that the recycling and reutilization of SiC from silicon wafer cutting slurry can be highly feasible and economical.
KeywordsSiC Wafer Cutting slurry Hydrocyclone
- 1.Sopori B, Devayajanam S, Shet S, Guhabiswas D, Basnyat P, Moutinho H, Gedvilas L, Jones K, Binns J, Appel J (2013) Characterizing damage on si wafer surfaces cut by slurry and diamond wire sawing. In: photovoltaic specialists conference (PVSC). 2013 IEEE 39th, Tampa, FL, pp 945–950Google Scholar
- 7.Lan CW, Lin YC, Wang TY, Tai YD (2010) Recovery method of silicon slurry. US Patent No. 2010/0215561Google Scholar
- 9.Hariharan AV, Ravi J, (2010) Method to convert silicon powder to high purity polysilicon through intermediate SiF4. US Patent No. 2010/0061911Google Scholar