Journal of Material Cycles and Waste Management

, Volume 20, Issue 1, pp 245–253 | Cite as

Influence factors of determining optimal organic solvents for swelling cured brominated epoxy resins to delaminate waste printed circuit boards



In the previous study, organic solvent dimethyl sulfoxide (DMSO) could effectively delaminate waste printed circuit boards (WPCBs) by swelling cured brominated epoxy resins (CBER). To find more organic solvents which can swell CBER, the total and three-dimensional Hansen solubility parameters (3d-HSP) of CBER in WPCBs were calculated by a group contribution method and an equilibrium swelling degree method. During testing equilibrium swelling degree, seventeen industrial common organic solvents were used to swell CBER in WPCBs. The results were that the total solubility parameter of CBER (δ t) was 24.6–26.4 (J/cm3)1/2, and 3d-HSP were that dispersion force (δ d) was 20.9(J/cm3)1/2, intermolecular dipole interaction force (δ p) was 11.1(J/cm3)1/2, and hydrogen-bonding force (δ h) was 11.6 (J/cm3)1/2. Then, 3-cresol was chosen to swell CBER in WPCBs according to its total and 3d-HSP. Result indicated that the WPCBs were delaminated completely in 3-cresol solvent. Finally, experimental results and theoretical analysis showed that the glass transition temperature (Tg) and solubility parameter of CBER were two very important factors for choosing organic solvents to delaminate the WPCBs. In addition, interaction forces of molecular functional groups between CBER and organic solvents were also an influence factor.


Waste printed circuit boards Cured brominated epoxy resins Swelling Hansen solubility parameters 



The authors are supported by Program for Innovative Research Team in University (No. IRT13078), Shanghai Cooperative Centre for WEEE Recycling and the Innovation Program of Shanghai Municipal Education Commission (14YZ002).


  1. 1.
    Long LS, Sun SZ, Zhong S, Dai WC, Liu JY, Song WF (2010) Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards. J Hazard Mater 177(1–3):626–632CrossRefGoogle Scholar
  2. 2.
    Hadi P, Xu M, Lin CSK, Hui CW, McKay G (2015) Waste printed circuit board recycling techniques and product utilization. J Hazard Mater 283:234–243CrossRefGoogle Scholar
  3. 3.
    Zhu P, Chen Y, Wang LY, Qian GR, Zhang WJ, Zhou M, Zhou J (2013) Dissolution of brominated epoxy resins by dimethyl sulfoxide to separate waste printed circuit boards. Environ Sci Technol 47(6):2654–2660CrossRefGoogle Scholar
  4. 4.
    Zhu P, Chen Y, Wang LY, Zhou M, Zhou J (2013) The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent. Waste Manag 33(2):484–488CrossRefGoogle Scholar
  5. 5.
    Sepúlveda A, Schluep M, Renaud FG, Streicher M, Kuehr R, Hagelüken C, Gerecke AC (2010) A review of the environmental fate and effects of hazardous substances released from electrical and electronic equipments during recycling: examples from China and India. Environ Impact Assess Rev 30(1):28–41CrossRefGoogle Scholar
  6. 6.
    Czégény Z, Jakab E, Blazsó M, Bhaskar T, Sakata Y (2012) Thermal decomposition of polymer mixtures of PVC, PET and ABS containing brominated flame retardant: formation of chlorinated and brominated organic compounds. J Anal Appl Pyrolysis 96:69–77CrossRefGoogle Scholar
  7. 7.
    Sadat-Shojai M, Bakhshandeh GR (2011) Recycling of PVC wastes. Polym Degrad Stab 96(4):404–415CrossRefGoogle Scholar
  8. 8.
    Damian C, Espuche E, Escoubes M (2001) Influence of three ageing types (thermal oxidation, radiochemical and hydrolytic ageing) on the structure and gas transport properties of epoxy-amine networks. Polym Degrad Stab 72(3):447–458CrossRefGoogle Scholar
  9. 9.
    Sun ML (2003) Application principle and technology of epoxy resin (Chinese version). Machinery Industry Press, Beijing, pp 478–482Google Scholar
  10. 10.
    Guang JR, Qing HR (2007) High polymer physics (Chinese version). Chemical Industry Press, Beijing, p 61Google Scholar
  11. 11.
    Hansen CM (2004) 50 Years with solubility parameters—past and future. Prog Org Coat 51:77–84CrossRefGoogle Scholar
  12. 12.
    Hansen CM (1967) The three dimensional solubility parameter and solvent diffusion cofficient. Danish Technical Press, CopenhagenGoogle Scholar
  13. 13.
    Arends D, Schlummer M, Mäurer A, Arends D, Mäurer A (2012) Removal of inorganic colour pigments from acrylonitrile butadiene styrene by dissolution-based recycling. J Mater Cycles Waste Manag 14(14):85–93CrossRefGoogle Scholar
  14. 14.
    Grause G, Hirahashi S, Toyoda H, Kameda T, Yoshioka T (2015) Solubility parameters for determining optimal solvents for separating PVC from PVC-coated PET fibers. J Mater Cycles Waste Manag 1–11. doi: 10.1007/s10163-015-0457-9
  15. 15.
    Nielsen TB, Hansen CM (2005) Elastomer swelling and Hansen solubility parameters. Polym Test 24(8):1054–1061CrossRefGoogle Scholar
  16. 16.
    Liu GY, Hoch M, Wrana C, Kulbaba K, Qiu GX (2013) A new way to determine the three-dimensional solubility parameters of hydrogenated nitrile rubber and the predictive power. Polym Test 32(6):1128–1134CrossRefGoogle Scholar
  17. 17.
    Levin M, Redelius P (2008) Determination of three-dimensional solubility parameters and solubility spheres for naphthenic mineral oils. Energy Fuels 22:3395–3401CrossRefGoogle Scholar
  18. 18.
    Sato T, Araki S, Morimoto M, Tanaka R, Yamamoto H (2014) Comparison of Hansen solubility parameter of asphaltenes extracted from bitumen produced in different geographical regions. Energy Fuels 28(2):891–897CrossRefGoogle Scholar
  19. 19.
    Krevelen DW (1981) Properties of polymers: their estimation and correlation with chemical structures (Chinese version). Science Press, Beijing, p 102Google Scholar
  20. 20.
    Liu DZ, Wang ZQ (2008) Solubility parameter and its application in coatings industry (Chinese version). Ocean Press, Beijing, p 102–112Google Scholar
  21. 21.
    Fraga F, Castro-Diaz C, Rodriguez-Nuñez E et al (2003) Physical aging for a epoxy network diglycidyl ether of bisphenol A/m-xylylenediamine. Polymer 44(19):5779–5784CrossRefGoogle Scholar
  22. 22.
    Auvergne R, Caillol S, David G, Boutevin B, Pascault JP (2014) Biobased thermosetting epoxy: present and future. Chem Rev 114(2):1082–1115CrossRefGoogle Scholar
  23. 23.
    Le Magda M, Dargent E, Youssef B, Guillet A, Idrac J, Saiter J-M (2012) Thermal properties evolution of PCB FR4 epoxy composites for mechatronic during very long ageing. Macromol Symp 315(1):143–151CrossRefGoogle Scholar
  24. 24.
    Lee HS, Jeong JH, Hong G, Cho HK, Baek BK, Koo CM, Hong SM, Kim J, Lee YW (2013) Effect of solvents on de-cross-linking of cross-linked polyethylene under subcritical and supercritical conditions. Ind Eng Chem Res 52:6633–6638CrossRefGoogle Scholar
  25. 25.
    Adamson MJ (1980) Thermal expansion and swelling of cured epoxy resin used in graphite/epoxy composite materials. J Mater Sci 15:1736–1745CrossRefGoogle Scholar
  26. 26.
    Loos AC, Springer GS (1981) In: Springer GS (ed) Environmental effects on composite materials. Technomic Publishing Co, Westport, p 34Google Scholar
  27. 27.
    Reichardt C (1987) Solvent effects in organic chemistry (Chinese version). Chemical Industry Press, Beijing, p 14Google Scholar

Copyright information

© Springer Japan 2016

Authors and Affiliations

  • P. Zhu
    • 1
    • 2
  • Y. Z. Yang
    • 1
  • Y. Chen
    • 1
  • G. R. Qian
    • 1
  • Q. Liu
    • 1
  1. 1.School of Environmental and Chemical EngineeringShanghai UniversityShanghaiPeople’s Republic of China
  2. 2.Shanghai Cooperative Centre for WEEE RecyclingShanghai Second Polytechnic UniversityShanghaiPeople’s Republic of China

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