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Influence factors of determining optimal organic solvents for swelling cured brominated epoxy resins to delaminate waste printed circuit boards

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Abstract

In the previous study, organic solvent dimethyl sulfoxide (DMSO) could effectively delaminate waste printed circuit boards (WPCBs) by swelling cured brominated epoxy resins (CBER). To find more organic solvents which can swell CBER, the total and three-dimensional Hansen solubility parameters (3d-HSP) of CBER in WPCBs were calculated by a group contribution method and an equilibrium swelling degree method. During testing equilibrium swelling degree, seventeen industrial common organic solvents were used to swell CBER in WPCBs. The results were that the total solubility parameter of CBER (δ t) was 24.6–26.4 (J/cm3)1/2, and 3d-HSP were that dispersion force (δ d) was 20.9(J/cm3)1/2, intermolecular dipole interaction force (δ p) was 11.1(J/cm3)1/2, and hydrogen-bonding force (δ h) was 11.6 (J/cm3)1/2. Then, 3-cresol was chosen to swell CBER in WPCBs according to its total and 3d-HSP. Result indicated that the WPCBs were delaminated completely in 3-cresol solvent. Finally, experimental results and theoretical analysis showed that the glass transition temperature (Tg) and solubility parameter of CBER were two very important factors for choosing organic solvents to delaminate the WPCBs. In addition, interaction forces of molecular functional groups between CBER and organic solvents were also an influence factor.

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References

  1. Long LS, Sun SZ, Zhong S, Dai WC, Liu JY, Song WF (2010) Using vacuum pyrolysis and mechanical processing for recycling waste printed circuit boards. J Hazard Mater 177(1–3):626–632

    Article  Google Scholar 

  2. Hadi P, Xu M, Lin CSK, Hui CW, McKay G (2015) Waste printed circuit board recycling techniques and product utilization. J Hazard Mater 283:234–243

    Article  Google Scholar 

  3. Zhu P, Chen Y, Wang LY, Qian GR, Zhang WJ, Zhou M, Zhou J (2013) Dissolution of brominated epoxy resins by dimethyl sulfoxide to separate waste printed circuit boards. Environ Sci Technol 47(6):2654–2660

    Article  Google Scholar 

  4. Zhu P, Chen Y, Wang LY, Zhou M, Zhou J (2013) The separation of waste printed circuit board by dissolving bromine epoxy resin using organic solvent. Waste Manag 33(2):484–488

    Article  Google Scholar 

  5. Sepúlveda A, Schluep M, Renaud FG, Streicher M, Kuehr R, Hagelüken C, Gerecke AC (2010) A review of the environmental fate and effects of hazardous substances released from electrical and electronic equipments during recycling: examples from China and India. Environ Impact Assess Rev 30(1):28–41

    Article  Google Scholar 

  6. Czégény Z, Jakab E, Blazsó M, Bhaskar T, Sakata Y (2012) Thermal decomposition of polymer mixtures of PVC, PET and ABS containing brominated flame retardant: formation of chlorinated and brominated organic compounds. J Anal Appl Pyrolysis 96:69–77

    Article  Google Scholar 

  7. Sadat-Shojai M, Bakhshandeh GR (2011) Recycling of PVC wastes. Polym Degrad Stab 96(4):404–415

    Article  Google Scholar 

  8. Damian C, Espuche E, Escoubes M (2001) Influence of three ageing types (thermal oxidation, radiochemical and hydrolytic ageing) on the structure and gas transport properties of epoxy-amine networks. Polym Degrad Stab 72(3):447–458

    Article  Google Scholar 

  9. Sun ML (2003) Application principle and technology of epoxy resin (Chinese version). Machinery Industry Press, Beijing, pp 478–482

    Google Scholar 

  10. Guang JR, Qing HR (2007) High polymer physics (Chinese version). Chemical Industry Press, Beijing, p 61

    Google Scholar 

  11. Hansen CM (2004) 50 Years with solubility parameters—past and future. Prog Org Coat 51:77–84

    Article  Google Scholar 

  12. Hansen CM (1967) The three dimensional solubility parameter and solvent diffusion cofficient. Danish Technical Press, Copenhagen

    Google Scholar 

  13. Arends D, Schlummer M, Mäurer A, Arends D, Mäurer A (2012) Removal of inorganic colour pigments from acrylonitrile butadiene styrene by dissolution-based recycling. J Mater Cycles Waste Manag 14(14):85–93

    Article  Google Scholar 

  14. Grause G, Hirahashi S, Toyoda H, Kameda T, Yoshioka T (2015) Solubility parameters for determining optimal solvents for separating PVC from PVC-coated PET fibers. J Mater Cycles Waste Manag 1–11. doi:10.1007/s10163-015-0457-9

  15. Nielsen TB, Hansen CM (2005) Elastomer swelling and Hansen solubility parameters. Polym Test 24(8):1054–1061

    Article  Google Scholar 

  16. Liu GY, Hoch M, Wrana C, Kulbaba K, Qiu GX (2013) A new way to determine the three-dimensional solubility parameters of hydrogenated nitrile rubber and the predictive power. Polym Test 32(6):1128–1134

    Article  Google Scholar 

  17. Levin M, Redelius P (2008) Determination of three-dimensional solubility parameters and solubility spheres for naphthenic mineral oils. Energy Fuels 22:3395–3401

    Article  Google Scholar 

  18. Sato T, Araki S, Morimoto M, Tanaka R, Yamamoto H (2014) Comparison of Hansen solubility parameter of asphaltenes extracted from bitumen produced in different geographical regions. Energy Fuels 28(2):891–897

    Article  Google Scholar 

  19. Krevelen DW (1981) Properties of polymers: their estimation and correlation with chemical structures (Chinese version). Science Press, Beijing, p 102

  20. Liu DZ, Wang ZQ (2008) Solubility parameter and its application in coatings industry (Chinese version). Ocean Press, Beijing, p 102–112

  21. Fraga F, Castro-Diaz C, Rodriguez-Nuñez E et al (2003) Physical aging for a epoxy network diglycidyl ether of bisphenol A/m-xylylenediamine. Polymer 44(19):5779–5784

    Article  Google Scholar 

  22. Auvergne R, Caillol S, David G, Boutevin B, Pascault JP (2014) Biobased thermosetting epoxy: present and future. Chem Rev 114(2):1082–1115

    Article  Google Scholar 

  23. Le Magda M, Dargent E, Youssef B, Guillet A, Idrac J, Saiter J-M (2012) Thermal properties evolution of PCB FR4 epoxy composites for mechatronic during very long ageing. Macromol Symp 315(1):143–151

    Article  Google Scholar 

  24. Lee HS, Jeong JH, Hong G, Cho HK, Baek BK, Koo CM, Hong SM, Kim J, Lee YW (2013) Effect of solvents on de-cross-linking of cross-linked polyethylene under subcritical and supercritical conditions. Ind Eng Chem Res 52:6633–6638

    Article  Google Scholar 

  25. Adamson MJ (1980) Thermal expansion and swelling of cured epoxy resin used in graphite/epoxy composite materials. J Mater Sci 15:1736–1745

    Article  Google Scholar 

  26. Loos AC, Springer GS (1981) In: Springer GS (ed) Environmental effects on composite materials. Technomic Publishing Co, Westport, p 34

    Google Scholar 

  27. Reichardt C (1987) Solvent effects in organic chemistry (Chinese version). Chemical Industry Press, Beijing, p 14

    Google Scholar 

Download references

Acknowledgements

The authors are supported by Program for Innovative Research Team in University (No. IRT13078), Shanghai Cooperative Centre for WEEE Recycling and the Innovation Program of Shanghai Municipal Education Commission (14YZ002).

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Authors and Affiliations

  1. School of Environmental and Chemical Engineering, Shanghai University, 99 Shangda Road, Shanghai, 200444, People’s Republic of China

    P. Zhu, Y. Z. Yang, Y. Chen, G. R. Qian & Q. Liu

  2. Shanghai Cooperative Centre for WEEE Recycling, Shanghai Second Polytechnic University, Shanghai, 201209, People’s Republic of China

    P. Zhu

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  1. P. Zhu
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Correspondence to P. Zhu.

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Zhu, P., Yang, Y.Z., Chen, Y. et al. Influence factors of determining optimal organic solvents for swelling cured brominated epoxy resins to delaminate waste printed circuit boards. J Mater Cycles Waste Manag 20, 245–253 (2018). https://doi.org/10.1007/s10163-016-0574-0

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