Abstract
In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable sol-gel method using γ-(2,3-epoxypropoxy)propytrimethoxysilane and dimethyldiethoxylsilane. The features of the reaction were investigated and the products were characterized in detail. Subsequently, various curing agents were explored to prepare transparent silane modified epoxy resins. The silane modified epoxy resins cured by PEA-230 at a fairly low temperature (40 °C/2 h then 60 °C/1 h) exhibited excellent thermal stability with a thermal degradation temperature as high as 316.5 °C and adjustable hardness between 40−60 shore A. The application tests showed the materials obtained were good candidates for LED filament bulb package.
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Yang, S. C.; Kim, J. S.; Jin, J. H.; Kwak, S. Y.; Bae, B. S. Thermal resistance of cycloaliphatic epoxy hybrimer based on sol-gel derived oligosiloxane for LED encapsulation. J. Appl. Polym. Sci. 2010, 117(4), 2140–2145.
Yang, X. F.; Shao, Q.; Yang, L. L.; Zhu, X. B.; Hua, X. L.; Zheng, Q. L.; Song, G. X.; Lai, G. Q. Preparation and performance of high refractive index silicone resin-type materials for the packaging of light-emitting diodes. J. Appl. Polym. Sci. 2013, 127(127), 1717–1724.
Yang, X. F.; Yang, L. L.; Cao, C.; Zhu, X. B.; Hua, X. L.; Zheng, Q. L.; Song, G. X.; Wu, L. B.; Lai, G. Q. Preparation of a silicone resin-type packaging material with high refractive index for light emitting diodes. Chem. J. Chin. Univ. 2012, 33(5), 1078–1083.
Huang, J. C.; Chu, Y. P.; Wei, M.; Deanin, R. D. Comparison of epoxy resins for applications in light-emitting diodes. Adv. Polym. Technol. 2004, 23(4), 298–306.
Bu, Z. Y.; Hu, J. J.; Li, B. G. Novel silicon-modified phenolic novolac resins: non-isothermal curing kinetics, and mechanical and thermal properties of their biofiber-reinforced composites. Thermochimica Acta 2014, 575(1), 244–253.
Kumar, R. N.; Keem, L. Y.; Mang, N. C.; Abubakar, A. Ultraviolet radiation curable epoxy resin encapsulant for light emitting diodes. J. Appl. Polym. Sci. 2006, 100(2), 1048–1056.
Zhang, Y. H.; Rhee, K. Y.; Park, S. J. Nanodiamond nanocluster-decorated graphene oxide/epoxy nanocomposites with enhanced mechanical behavior and thermal stability. Compos. Part B: Engineer. 2017, 114, 111–120.
Yang, S. C.; Kwak, S. Y.; Jin, J. H.; Kim, J. S.; Choi, Y. W.; Paik, K. W.; Bae, B. S. Thermally resistant UV-curable epoxysiloxane hybrid materials for light emitting diode (LED) encapsulation, J. Mater. Chem. 2012, 22(18), 8874–8880.
Kim, J. S.; Yang, S. C.; Kwak, S. Y.; Choi, Y. W.; Paik, K. W.; Bae, B. S. High performance encapsulant for light-emitting diodes (LEDs) by a sol-gel derived hydrogen siloxane hybrid. J. Mater. Chem. 2012, 22(16), 7954–7960.
Kim, J. S.; Yang, S. C.; Bae, B. S. Thermally stable transparent sol-gel based siloxane hybrid material with high refractive index for light emitting diode (LED) encapsulation. Chem. Mater. 2010, 22(11), 3549–3555.
Rath, S. K.; Chavan, J. G.; Sasane, S.; Srivastava, A.; Patri, M.; Samui, A. B.; Chakraborty, B. C.; Sawant, S. N. Coatings of PDMS-modified epoxy via urethane linkage: Segmental correlation length, phase morphology, thermomechanical and surface behavior. Prog. Org. Coat. 2009, 65(3), 366–374.
Huang, S. S.; Zhou, W. C.; Luo, F.; Zhu, D. M. Mechanical and dielectric properties of short-carbon-fibers/epoxy-modifiedorganic- silicone-resin as heat resistant microwave absorbing coatings. J. Appl. Polym. Sci. 2013, 130(130), 1392–1398.
Sobhani, S.; Jannesari, A.; Bastani, S. Effect of molecular weight and content of PDMS on morphology and properties of silicone-modified epoxy resin. J. Appl. Polym. Sci., 2012, 123(1), 162–178.
Ahmad, S.; Ashraf, S. M.; Sharmin, E.; Mohomad, A.; Alam, M. Synthesis, formulation, and characterization of siloxanemodified epoxy-based anticorrosive paints. J. Appl. Polym. Sci. 2006, 100(100), 4981–4991.
Kumar, S. A.; Balakrishnan, T.; Alagar, M.; Denchev, Z. Development and characterization of silicone/phosphorus modified epoxy materials and their application as anticorrosion and antifouling coatings. Prog. Org. Coat. 2006, 55(3), 207–217.
Ahmad, S.; Gupta, A. P.; Sharmin, E.; Alam, M.; Pandey, S. K. Synthesis, characterization and development of high performance siloxane-modified epoxy paints. Prog. Org. Coat. 2005, 54(3), 248–255.
Wu, Q.; Zhang, C.; Liang, R.; Wang, B. Combustion and thermal properties of epoxy/phenyltrisilanol polyhedral oligomeric silsesquioxane nanocomposites. J. Therm. Anal. Calorim., 2010, 100(3), 1009–1015.
Zhang, D. H.; Liang, E. B.; Li, T. C.; Chen, S. F.; Zhang, J. H.; Cheng, X. J.; Zhou, J. L.; Zhang, A. Q.. Environment-friendly synthesis and performance of a novel hyperbranched epoxy resin with a silicone skeleton. RSC Adv. 2013, 3(9), 3095–3102.
Zhang, D. H.; Liang, E. B.; Li, T. C.; Chen, S. F.; Zhang, J. H.; Cheng, X. J.; Zhou, J. L.; Zhang, A. Q. The effect of molecular weight of hyperbranched epoxy resins with a silicone skeleton on performance. RSC Adv. 2013, 3(24), 9522–9529.
ASTM E313-10: Standard practice for calculating yellowness and whiteness indices from instrumentally measured color coordinates. ASTM, Book Standards 2010, 6, pp6. DOI: 10.1520/E0313–10
Zhang, Y. H.; Choi, J. R.; Park, S. J. Thermal conductivity and thermo-physical properties of nanodiamond-attached exfoliated hexagonal boron nitride/epoxy nanocomposites for microelectronics, Compos. Part A: Appl. Sci. Manufactur. 2017, 101, 227–236
Zhu, J.; Peng, H.; F. Rodriguez-Macias; Margrave J. L.; Khabashesku V. N.; Imam A.; Lozano K.; Barrera E. V. Reinforcing epoxy polymer composites through covalent integration of functionalized nanotubes. Adv. Funct. Mater. 2004, 14(7), 643–648.
Zhang, Y. H.; Park, S. J. In situ modification of nanodiamonds by mercapto-terminated silane agent for enhancing the mechanical interfacial properties of nitrile butadiene rubber nanocomposites. Polym. Comps. 2017, DOI: 10.1002/pc.24367
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The authors are grateful for financial support from the Zhejiang Provincial Natural Science Foundation of China (No. Y14E030008), the Commonweal Technology Application Research Project of Zhejiang Province (No. 2013C31079).
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Yang, XF., Liu, J., Chen, Q. et al. A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package. Chin J Polym Sci 36, 649–654 (2018). https://doi.org/10.1007/s10118-018-2028-8
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DOI: https://doi.org/10.1007/s10118-018-2028-8