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Analysis of fatigue delamination growth in flip-chip package

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Abstract

An incremental crack extension procedure is implemented for simulating the growth of an interface defect in an electronic flip-chip device subjected to fatigue temperature cycling. The distributions of fracture mechanics parameters including the strain energy release rate, the stress intensity factors and phase angles along the curvilinear front of an embedded corner defect on the interface of silicon die and underfill are estimated and substituted into a subcritical crack growth model to predict the evolution of the defect under cyclic loading condition. It is observed from the analysis that the corner defect is under crack faces contact condition during temperature cycling, and consequently, the delamination growth is under mode-II and mode-III driving forces. In addition, the crack growth rate is highest in the middle of the crack front, and the corner crack evolves from an initially concave front to a quarter-circular front under temperature cycling.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Cheng Kung University, Tainan, 701, Taiwan, ROC

    Y.-S. Lai, C.-H. Chen & T.-C. Chiu

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  1. Y.-S. Lai
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  2. C.-H. Chen
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  3. T.-C. Chiu
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Correspondence to T.-C. Chiu.

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Presented at the Third Asian Conference on Mechanics of Functional Materials and Structures at the Indian Institute of Technology Delhi in New Delhi, India, December 5–8, 2012.

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Lai, YS., Chen, CH. & Chiu, TC. Analysis of fatigue delamination growth in flip-chip package. Acta Mech 225, 2761–2773 (2014). https://doi.org/10.1007/s00707-014-1201-6

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  • DOI: https://doi.org/10.1007/s00707-014-1201-6

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