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Laterally vibrating MEMS resonant vacuum sensor based on cavity-SOI process for evaluation of wide range of sealed cavity pressure

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Abstract

This paper reports a laterally vibrating MEMS resonant vacuum sensor which senses ambient pressure based on the squeeze-film damping effect. The single-anchored double-ended tuning fork structure is proposed to minimize anchor loss and thermoelastic dissipation. The squeeze-film damping gap width is designed to be changeable for the purpose of adjusting the squeeze-film damping effect at different gas pressure. By making the squeeze-film damping dominant and suppressing other energy loss mechanisms, the low pressure end of detectable range is enlarged and as the result a wider detectable pressure range can be achieved. The resonator was fabricated by cavity silicon-on-insulator technique for the purpose of design and fabrication flexibility, and was characterized in a vacuum chamber. The proposed sensor can sense the air pressure at relatively high quality factor from around 60 to 30,000 in the range of 1000–1 Pa. The structure design and fabrication is compatible with standard MEMS processes and provides a path towards the application for the evaluation of the vacuum level of sealed micro-size cavities for wafer level integration.

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References

  • Andrews M, Harris I, Turner G (1993) A comparison of squeeze-film theory with measurements on a microstructure. Sens Actuators A 36:79–87

    Article  Google Scholar 

  • Bao M, Yang H (2007) Squeeze film air damping in MEMS. Sens Actuators A 136:3–27. https://doi.org/10.1016/j.sna.2007.01.008

    Article  Google Scholar 

  • Cheng Y-T, Hsu W-T, Najafi K, Nguyen C-C, Lin L (2002) Vacuum packaging technology using localized aluminum/silicon-to-glass bonding. J Microelectromech Syst 11:556–565

    Article  Google Scholar 

  • Dolleman RJ, Davidovikj D, Cartamil-Bueno SJ, van der Zant HS, Steeneken PG (2015) Graphene squeeze-film pressure sensors. Nano Lett 16:568–571

    Article  Google Scholar 

  • Frömel J, Billep D, Gessner T, Wiemer M (2006) Application of micromechanical resonant structures for measuring the sealing of bonded sensor systems. Microsyst Technol 12:481–483

    Article  Google Scholar 

  • Graham AB et al (2010) A method for wafer-scale encapsulation of large lateral deflection MEMS devices. J Microelectromech Syst 19:28–37

    Article  Google Scholar 

  • Huang Y, Ergun AS, Haeggstrom E, Badi MH, Khuri-Yakub BT (2003) Fabricating capacitive micromachined ultrasonic transducers with wafer-bonding technology. J Microelectromech Syst 12:128–137

    Article  Google Scholar 

  • Hutcherson S, Ye W (2004) On the squeeze-film damping of micro-resonators in the free-molecule regime. J Micromech Microeng 14:1726–1733. https://doi.org/10.1088/0960-1317/14/12/018

    Article  Google Scholar 

  • Kainz A, Hortschitz W, Stifter M, Schalko J, Keplinger F (2014) Optimization of passive air damping of MOEMS vibration sensors. Procedia Eng 87:440–443. https://doi.org/10.1016/j.proeng.2014.11.326

    Article  Google Scholar 

  • Kainz A, Hortschitz W, Schalko J, Jachimowicz A, Keplinger F (2015) Air damping as design feature in lateral oscillators. Sens Actuators A 236:357–363. https://doi.org/10.1016/j.sna.2015.11.005

    Article  Google Scholar 

  • Kumar L et al (2015) MEMS oscillating squeeze-film pressure sensor with optoelectronic feedback. J Micromech Microeng 25:045011. https://doi.org/10.1088/0960-1317/25/4/045011

    Article  Google Scholar 

  • Lee B, Seok S, Chun K (2003) A study on wafer level vacuum packaging for MEMS devices. J Micromech Microeng 13:663

    Article  Google Scholar 

  • Lee JEY, Zhu Y, Seshia AA (2008) A bulk acoustic mode single-crystal silicon microresonator with a high-quality factor. J Micromech Microeng 18:064001. https://doi.org/10.1088/0960-1317/18/6/064001

    Article  Google Scholar 

  • Legtenberg R, Tilmans HA (1994) Electrostatically driven vacuum-encapsulated polysilicon resonators. Part I: Design and fabrication. Sens Actuators A 45:57–66

    Article  Google Scholar 

  • Li P, Fang Y (2010) A molecular dynamics simulation approach for the squeeze-film damping of MEMS devices in the free molecular regime. J Micromech Microeng 20:035005. https://doi.org/10.1088/0960-1317/20/3/035005

    Article  Google Scholar 

  • Liu C, Hirano H, Froemel J, Tanaka S (2017) Wafer-level vacuum sealing using AgAg thermocompression bonding after fly-cut planarization. Sens Actuators A 261:210–218. https://doi.org/10.1016/j.sna.2017.05.020

    Article  Google Scholar 

  • Mol L, Rocha LA, Cretu E, Wolffenbuttel RF (2009) Squeezed film damping measurements on a parallel-plate MEMS in the free molecule regime. J Micromech Microeng 19:074021. https://doi.org/10.1088/0960-1317/19/7/074021

    Article  Google Scholar 

  • Rodriguez J et al (2017) Wide-range temperature dependence studies for devices limited by thermoelastic dissipation and anchor damping. In: Solid-state sensors, actuators and microsystems (TRANSDUCERS), 2017 19th international conference on, 2017. IEEE, pp 1100–1103

  • Shao L, Palaniapan M (2008) Effect of etch holes on quality factor of bulk-mode micromechanical resonators. Electron Lett 44:938–940

    Article  Google Scholar 

  • Southworth DR, Craighead HG, Parpia JM (2009) Pressure dependent resonant frequency of micromechanical drumhead resonators. Appl Phys Lett 94:213506. https://doi.org/10.1063/1.3141731

    Article  Google Scholar 

  • Tanaka S (2014) Wafer-level hermetic MEMS packaging by anodic bonding and its reliability issues. Microelectron Reliab 54:875–881

    Article  Google Scholar 

  • Trusov AA, Shkel AM (2007) Capacitive detection in resonant MEMS with arbitrary amplitude of motion. J Micromech Microeng 17:1583–1592. https://doi.org/10.1088/0960-1317/17/8/022

    Article  Google Scholar 

  • Trusov AA, Schofield AR, Shkel AM (2011) Micromachined rate gyroscope architecture with ultra-high quality factor and improved mode ordering. Sens Actuators A 165:26–34. https://doi.org/10.1016/j.sna.2010.01.007

    Article  Google Scholar 

  • Waelti M, Schneeberger N, Paul O, Baltes H (1998) Package quality testing using integrated pressure sensor. In: Proceedings-SPIE the International Society for Optical Engineering, 1998. SPIE International Society for Optical, pp 0981–0986

  • Welham CJ, Gardner JW, Greenwood J (1996) A laterally driven micromachined resonant pressure sensor. Sens Actuators A 52:86–91

    Article  Google Scholar 

  • Zotov SA, Simon BR, Prikhodko IP, Trusov AA, Shkel AM (2014) Quality factor maximization through dynamic balancing of tuning fork resonator. IEEE Sens J 14:2706–2714

    Article  Google Scholar 

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Acknowledgements

This paper was partly supported by a project commissioned by the New Energy and Industrial Technology Development Organization (NEDO). The author, Cong Liu, thanks the China Scholarship Council (CSC) (no. 201506120054) for scholarship support.

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Authors and Affiliations

  1. Department of Robotics, Graduate School of Engineering, Tohoku University, Sendai, 980-8579, Japan

    Cong Liu, Jianlin Chen, Takashiro Tsukamoto & Shuji Tanaka

  2. Microsystem Integration Center, Tohoku University, Sendai, 980-8579, Japan

    Shuji Tanaka

  3. WPI Advanced Institute for Materials Research, Tohoku University, Sendai, 980-8577, Japan

    Joerg Froemel

Authors
  1. Cong Liu
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  2. Joerg Froemel
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  3. Jianlin Chen
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  4. Takashiro Tsukamoto
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  5. Shuji Tanaka
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Correspondence to Cong Liu.

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Liu, C., Froemel, J., Chen, J. et al. Laterally vibrating MEMS resonant vacuum sensor based on cavity-SOI process for evaluation of wide range of sealed cavity pressure. Microsyst Technol 25, 487–497 (2019). https://doi.org/10.1007/s00542-018-3984-1

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  • DOI: https://doi.org/10.1007/s00542-018-3984-1

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