Stability characterization of vacuum encapsulated MEMS resonators with Au–Sn solder bonding
- 140 Downloads
This paper presents a vacuum encapsulation technique and stability characterization for MEMS resonator. Sn-rich Au–Sn solder bonding is used to achieve reliable hermetic packaging with high shear strength. Simple planar feedthrough structure is utilized to achieve electrical interconnection and low cost of packaging. The stabilities of the encapsulated resonator are systematically studied, including frequency stability, temperature stability, long-term hermeticity, and mechanical reliability. The short-term and medium-term frequency stability are ± 0.4 and ± 3 ppm, respectively. The temperature cycle test is introduced between − 20 and 80 °C, and the resonant-frequency drift of the packaged resonator is within ± 4 ppm between 40 temperature cycles. Furthermore, the packaged resonator is temperature compensated by micro-oven, which obtained a frequency stability range of ± 13 ppm between 20 and 100 °C. The packaged resonator shows favorable long-term stability of the Q-factor over 200 days and average shear strength of 43.93 MPa among 12 samples.
This work was supported by the National Natural Science Foundation of China (61734007), the Key Research Program of Frontier Science of CAS (QYZDY-SSW-JSC004), the National Key Research and Development Program of China (2017YFB0405400), the Key Research & Development Program of Jiangsu Province, China (BE2016007-2), and the Major Project of Natural Science Research of the Higher Education Institutions of Jiangsu Province, China (16KJA510006).
- Chen YH, Ng JE, Shin DD, Ahn CH, Yang YS, Flader IB, Hong VA, Kenny TW (2016) Ovenized dual-mode clock (ODMC) based on highly doped single crystal silicon resonators. In: Proceedings of IEEE international conference on micro electro mechanical systems, Shanghai, China, 24–28 Jan 2016, pp 91–94Google Scholar
- Datasheet from SiTime Corporation web-site (2013) http://www.sitime.com/products/datasheets/sit9120/SiT9120-datasheet.pdf
- Datasheet from SiTime Corporation web-site (2017) http://www.sitime.com/products/datasheets/sit9366/SiT9366-datasheet.pdf
- Ho GK, Sundaresan K, Pourkamali S, Ayazi F (2006) Temperature compensated IBAR reference oscillators. In: Proceedings of IEEE international conference on micro electro mechanical systems, Istanbul, Turkey, 22–26 Jan 2006, pp 910–913Google Scholar
- Hsu WT (2006) Reliability of silicon resonator oscillators. In: Proceedings of IEEE international frequency control symposium and exposition, Miami, USA, 4–7 June 2006, pp 389–392Google Scholar
- Hsu WT (2008) Resonator miniaturization for oscillators. In: Proceedings of IEEE international frequency control symposium, Honolulu, USA, 19–21 May 2008, pp 392–395Google Scholar
- Hsu WT, Nguyen CTC (1998) Geometric stress compensation for enhanced thermal stability in micromechanical resonators. In: Proceedings of IEEE ultrasonics symposium, Sendai, Japan, 5–8 Oct 1998, pp 945–948Google Scholar
- Hsu WT, Pai MF (2007) The new heart beat of electronics - silicon MEMS oscillators. In: Proceedings of electronic components and technology conference, Reno, USA, 29 May–1 June 2007, pp 1895–1899Google Scholar
- Nguyen CTC, Howe RT (1993) Microresonator frequency control and stabilization using an integrated micro oven. In: Proceedings of international solid-state sensors, actuators and microsystems conference, Yokohama, Japan, 7–10 Jun 1993, pp 1040–1043Google Scholar
- Shin DD, Chen YH, Flader IB, Kenny TW (2017) Epitaxially encapsulated resonant accelerometer with an on-chip micro-oven. In: Proceedings of international solid-state sensors, actuators and microsystems conference, Kaohsiung, Taiwan, 18–22 June 2017, pp 595–598Google Scholar
- Xie J, Liu YF, Zhao H, Yang JL, Yang FH (2011) Reliable low-cost fabrication and characterization methods for micromechanical disk resonators. In: Proceedings of international solid-state sensors, actuators and microsystems conference, Beijing, China, 5–9 June 2011, pp 2462–2465Google Scholar