Microsystem Technologies

, Volume 24, Issue 9, pp 3907–3913 | Cite as

Characterization of the electrical and thermal properties of a metallic thin-film line

  • Takahiro Sasaki
  • Yuan Li
  • Masumi Saka
Technical Paper


In this work, an evaluation method was presented to systematically characterize the electrical and thermal properties of a metallic thin-film line. A series of current-stressing experiments were carried out on the Ag thin-film lines with different geometrical properties on substrates. In combination with the corresponding electrothermal analyses, the temperature-dependent resistivity and thermal conductivity of the Ag thin-film lines, as well as interfacial thermal conductance between the lines and their substrates, were able to be characterized. These characterizations were used to predict the melting current of the Ag thin-film lines, which show good consistency with the experimental values. They therefore validate the effectiveness of the present evaluation method, which will greatly contribute to the development of next-generational electronics with ideal thermal designs.



The authors would like to thank Prof. H. Tohmyoh for his valuable discussions. This work was supported by JSPS KAKENHI Grant-in Aid for Young Scientists (B) (no. 26820001) and Scientific Research (B) (no. 26289001). Part of this work was performed at the Micro/Nano-Machining Research and Education Center of Tohoku University.


  1. Baker H, Benjamin D (1979) Metals handbook. American Society for Metals, OhioGoogle Scholar
  2. Carslaw HS, Jaeger HC (1959) Conduction of heat in solids. Clarendon, OxfordzbMATHGoogle Scholar
  3. Chalmers B (1964) Principles of solidification. John Wiley, New YorkGoogle Scholar
  4. Dames C (2013) Measuring the thermal conductivity of thin films: 3 omega and related electrothermal methods. Annu Rev Heat Transf 16:7–49CrossRefGoogle Scholar
  5. Ellmer K (2012) Past achievements and future challenges in the development of optically transparent electrodes. Nat Photonics 6:809–817CrossRefGoogle Scholar
  6. Fuentes GG, Elizalde E, Sanz JM (2001) Optical and electronic properties of TiCxNy films. J Appl Phys 90:2737CrossRefGoogle Scholar
  7. Ghosh DS, Chen TL, Pruneri V (2010) High figure-of-merit ultrathin metal transparent electrodes incorporating a conductive grid. Appl Phys Lett 96:041109CrossRefGoogle Scholar
  8. Grygiel C, Simon C, Mercey B, Prellier W, Frésard R, Limelette P (2007) Thickness dependence of the electronic properties in V2O3 thin films. Appl Phys Lett 91:262103CrossRefGoogle Scholar
  9. Hanaoka Y, Hinode K, Takeda K, Kodama D (2002) Increase in electrical resistivity of copper and aluminum fine lines. Mater Trans 43:1621–1623CrossRefGoogle Scholar
  10. Hinode K, Hanaoka Y, Takeda K, Kondo S (2001) Resistivity increase in ultrafine-line copper conductor for ULSIs. Jpn J Appl Phys 40:1097–1099CrossRefGoogle Scholar
  11. Hou J, Wang X, Guo J (2006) Thermal characterization of micro/nanoscale conductive and non-conductive wires based on optical heating and electrical thermal sensing. J Phys D Appl Phys 39:3362–3370CrossRefGoogle Scholar
  12. Kang MG, Park HJ, Ahn SH, Xu T, Guo LJ (2010) Toward low-cost, high-efficiency, and scalable organic solar cells with transparent metal electrode and improved domain morphology. IEEE J Sel Top Quantum Electron 16:1807–1820CrossRefGoogle Scholar
  13. Kimling J, Martens S, Nielsch K (2011) Thermal conductivity measurements using 1ω and 3ω methods revisited for voltagedriven setups. Rev Sci Instrum 82:074903CrossRefGoogle Scholar
  14. Kittel C (1976) Introduction to solid state physics. John Wiley, New YorkzbMATHGoogle Scholar
  15. Lacour SP, Jones J, Suo Z, Wagner S (2004) Design and performance of thin metal film interconnects for skin-like electronic circuits. IEEE Electron Device Lett 25:179–181CrossRefGoogle Scholar
  16. Lee J, Lee P, Lee H, Lee D, Lee SS, Ko SH (2012) Very long Ag nanowire synthesis and its application in a highly transparent, conductive and flexible metal electrode touch panel. Nanoscale 4:6408–6414CrossRefGoogle Scholar
  17. Li Y, Tsuchiya K, Tohmyoh H, Saka M (2013) Numerical analysis of the electrical failure of a metallic nanowire mesh due to Joule heating. Nanoscale Res Lett 8:370CrossRefGoogle Scholar
  18. Lyman T (1961) Metals handbook. American Society for Metals, OhioGoogle Scholar
  19. Manepalli R, Stepniak F, Bidstrup-Allen SA, Kohl PA (1999) Silver metallization for advanced interconnects. IEEE Trans Adv Packag 22:4–8CrossRefGoogle Scholar
  20. Nakazawa E, Hara M, Uchida H, Suganuma K (2015) Transparent conductive electrode technology of silver nanowire. In: 21st Symposium on “Microjoining and Assembly Technology in Electronics’’, pp 223–226 (in Japanese) Google Scholar
  21. Park JH, Lee DY, Kim YH, Kim JK, Lee JH, Park JH, Lee TW, Cho JH (2014) Flexible and transparent metallic grid electrodes prepared by evaporative assembly. ACS Appl Mater Interfaces 6:12380–12387CrossRefGoogle Scholar
  22. Peranio N, Eibl O, Nurnus J (2006) Structural and thermoelectric properties of epitaxially grown Bi2Te3 thin films and superlattices. J Appl Phys 100:114306CrossRefGoogle Scholar
  23. Philofsky E, Hall EL (1975) A review of the limitations of aluminum thin films on semiconductor devices. IEEE Trans Parts Hybrids Packag 11:281–290CrossRefGoogle Scholar
  24. Rosenberg R, Edelstein DC, Hu CK, Rodbell KP (2000) Copper metallization for high performance silicon technology. Annu Rev Mater Sci 30:229–262CrossRefGoogle Scholar
  25. Sam FLM, Mills CA, Rozanski LJ, Silva SRP (2014) Thin film hexagonal gold grids as transparent conducting electrodes in organic light emitting diodes. Laser Photon Rev 8:172–179CrossRefGoogle Scholar
  26. Sasaki T, Li Y, Saka M (2015) Characterization on electrical and thermal properties of an Ag thin wire. In: 21st Symposium on “Microjoining and Assembly Technology in Electronics”, 423–424 (in Japanese) Google Scholar
  27. Savitskii YM (1989) Handbook of precious metals. Hemisphere Publishing Corporation, New YorkGoogle Scholar
  28. Sayer RA, Zeng J, Hsu HH, Peroulis D, Fisher TS (2012) Thermal and electrical conductivities of nanocrystalline nickel microbridges. J Microelectromech Syst 21:850–858CrossRefGoogle Scholar
  29. Schmidt AJ, Cheaito R, Chiesa M (2010) Characterization of thin metal films via frequency-domain thermoreflectance. J Appl Phys 107:024908CrossRefGoogle Scholar
  30. Shojaei-Zadeh S, Zhang S, Liu W, Yang Y, Sadeghipour SM, Asheghi M (2004) Thermal characterization of thin film Cu interconnects for the next generation of microelectronic devices. Intersoc Conf Therm Thermomech Phenom Electron Syst 2:575–583CrossRefGoogle Scholar
  31. Stojanovic N, Yun J, Washington EBK, Berg JM, Holtz MW, Temkin H (2007) Thin-Film thermal conductivity measurement using microelectrothermal test structures and finite-element-model-based data analysis. J Microelectromech Syst 16:1269–1275CrossRefGoogle Scholar
  32. Tsuchiya K, Li Y, Saka M (2014) Consistent melting behavior induced by Joule heating between Ag microwire and nanowire meshes. Nanoscale Res Lett 9:239CrossRefGoogle Scholar
  33. Völklein F, Reith H, Cornelius TW, Rauber M, Neumann R (2009) The experimental investigation of thermal conductivity and the Wiedemann–Franz law for single metallic nanowires. Nanotechnology 20:325706CrossRefGoogle Scholar
  34. Volkov YA, Palatnik LS, Pugachev AT (1976) Investigation of the thermal properties of thin aluminum films. Sov Phys JETP 43:2244–2250Google Scholar

Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  1. 1.Department of FinemechanicsTohoku UniversitySendaiJapan
  2. 2.Department of Mechanical Engineering and Intelligent SystemsTohoku Gakuin UniversityTagajyoJapan

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