Advertisement

Microsystem Technologies

, Volume 24, Issue 9, pp 3863–3866 | Cite as

Improved isolation RF MEMS switch with post release ashing

  • Khushbu Mehta
  • Deepak Bansal
  • Anuroop Bajpai
  • Prem Kumar
  • Amit Kumar
  • Kamaljit Rangra
Technical Paper
  • 80 Downloads

Abstract

RF MEMS switches have moving microstructures which are realized either by dry release method or by wet releasing process. In dry release process, suspended bridges gets curled up due to high process temperature while in wet release method, surface of the released devices is get contaminated which affects the final performance of the device. In this paper, a mixed release process of wet and dry is presented to release the stiction free suspended microstructures. Contamination from the devices is removed by plasma cleaning. Isolation of the device under test has been improved to 22 from 15 dB after plasma exposure.

Notes

Compliance with ethical standards

Conflict of interest

The authors declare that there is no conflict of interest related to publication of this paper.

References

  1. Bansal D, Kumar A, Sharma A, Kumar P, Rangra K (2014) Design of novel compact anti-stiction and low insertion loss RF MEMS switch. Microsyst Technol 20:337–340CrossRefGoogle Scholar
  2. Bansal D, Bajpai A, Kumar P, Kaur M, Rangra K (2016) Fabrication and analysis of RF MEMS series capacitive SPDT switc. J Micro Nanolithogr 15(4):045001CrossRefGoogle Scholar
  3. Bansal D, Bajpai A, Kumar P, Kaur M, Kumar A, Chandran A, Rangra K (2017) Low voltage driven RF MEMS capacitive switch using reinforcement for reduced buckling. J Micromech Microeng 27(2):24001CrossRefGoogle Scholar
  4. Hook DA, Ohlhausen JA, Krim J, Dugger MT (2010) Evaluation of oxygen plasma and UV ozone methods for cleaning of occluded areas in MEMS devices. J Microelectromech Syst 19(6):1292–1298CrossRefGoogle Scholar
  5. Sharma A, Jhanwar P, Bansal D, Kumar A, Kaur M, Pandey S, Kumar P, Kumar D, Rangra K (2014) Comparative study of various release methods for gold surface micromachining. J Micro Nanolithogr 13(1):013005CrossRefGoogle Scholar
  6. Walker M, Nordquist C, Czaplewski D, Patrizi G, McGruer N, Krim J (2010) Impact of in situ oxygen plasma cleaning on resistance of Ru and Au-Ru based RF microelectromechanical system contact in vacuum. J Appl Phys 107:084509CrossRefGoogle Scholar
  7. Younis S, Saleem MM, Zubair M, Tahir Zaidi SM (2018) Multiphysics design optimization of RF MEMS switch using response surface methodology. Microelectron J 71:47–60CrossRefGoogle Scholar

Copyright information

© Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  • Khushbu Mehta
    • 1
  • Deepak Bansal
    • 1
  • Anuroop Bajpai
    • 1
  • Prem Kumar
    • 1
  • Amit Kumar
    • 1
  • Kamaljit Rangra
    • 1
  1. 1.CSIR-Central Electronics Engineering Research InstitutePilaniIndia

Personalised recommendations