In the current investigation, various mass fractions (0, 0.5, 1.5, 5 and 10 wt%) of Ni were doped into Cu substrate, and influences of Ni addition on the microstructure evolution and mechanical property of the Sn–58Bi/Cu–xNi solder joint were investigated. Results showed that the growth rate of intermetallic compound (IMC) would increase with the Ni addition added from 0 to 5 wt% and remarkably decreased for Sn–58Bi/Cu–10Ni joint system. It indicated that the growth rate of IMC layer would decrease when 10 wt% Ni was added into the alloy. Besides, the tensile strength reduced with increase in the IMC thickness, which was under the synergistic effect of increasing liquid-state reaction time and the content of Ni addition (0–5 wt%). Moreover, the fracture mechanism gradually transformed from ductile fracture mode to brittle fracture mode with the decrease in joint strength.
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D.C. Lin, S. Liu, T.M. Guo, G.-X. Wang, T.S. Srivatsan, M. Petraroli, An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin–lead solder. Mater. Sci. Eng. A 60, 285–292 (2003)
W. Dreyer, W.H. Müller, Modeling diffusional coarsening in eutectic tin/lead solders: a quantitative approach. Int. J. Solids Struct. 38, 1433–1458 (2001)
L. Li, W.H. Müller, Computer modeling of the coarsening process in tin–lead solders. Comput. Mater. Sci. 21, 159–184 (2001)
X. Chen, D.-H. Yu, K.S. Kim, Experimental study on ratcheting behavior of eutectic tin–lead solder under multiaxial loading. Mater. Sci. Eng. A 406, 86–94 (2005)
D. Lin, G.X. Wang, T.S. Srivatsan, M. Al-Hajri, M. Petraroli, The influence of copper nanopowders on microstructure and hardness of lead–tin solder. Mater. Lett. 53, 333–338 (2002)
X. Hu, H. Qiu, X. Jiang, Effect of Ni addition into the Cu substrate on the interfacial IMC growth during the liquid-state reaction with Sn–58Bi solder. J. Mater. Sci. Mater. Electron. 30, 1907–1918 (2019)
Z. Zhang, X. Hu, X. Jiang, Y. Li, Influences of mono-Ni(P) and dual-Cu/Ni(P) plating on the interfacial microstructure evolution of solder joints. Metall. Mater. Trans. A 50, 480–492 (2019)
H. Qiu, X. Hu, X. Jiang, Q. Li, The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration. Mater. Lett. 256, 126609 (2019)
J. Chen, H. Zhang, P. Zhang, Z. Yu, Y. Zhang, C. Yu, H. Lu, The Zn accumulation behavior, phase evolution and void formation in Sn-xZn/Cu systems by considering trace Zn: a combined experimental and theoretical study. J. Mater. Res. Technol. 8, 4141–4150 (2019)
M. Xiong, L. Zhang, Interface reaction and intermetallic compound growth behavior of Sn–Ag–Cu lead-free solder joints on different substrates in electronic packaging. J. Mater. Sci. 54, 1741–1768 (2019)
C.-J. Lee, J.-O. Bang, S.-B. Jung, Effect of black residue on the mechanical properties of Sn–58Bi epoxy solder joints. Microelectron. Eng. 216, 111055 (2019)
Y.-A. Shen, S. Zhou, J. Li, K.N. Tu, H. Nishikawa, Thermomigration induced microstructure and property changes in Sn–58Bi solders. Mater. Des. 166, 107619 (2019)
W.-R. Myung, Y. Kim, S.-B. Jung, Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish. J. Alloys Compd. 615, 5411–5417 (2014)
J.-H. Kim, Y.-C. Lee, S.-M. Lee, S.-B. Jung, Effect of surface finishes on electromigration reliability in eutectic Sn–58Bi solder joints. Microelectron. Eng. 120, 77–84 (2014)
Q.K. Zhang, Z.F. Zhang, In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints. Mater. Sci. Eng. A 528, 2686–2693 (2011)
A.A. El-Daly, A.A. Ibrahiem, Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn–Bi lead-free solders solidified under rotating magnetic field. J. Alloys Compd. 730, 47–56 (2018)
P.J. Shang, Z.Q. Liu, D.X. Lia, J.K. Shang, Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints. Scr. Mater. 58, 409–412 (2008)
X.Y. Pang, Z.Q. Liu, S.Q. Wang, J.K. Shang, First-principles Investigation of Bi Segregation at the solder interface of Cu/Cu3Sn(010). J. Mater. Sci. Technol. 12, 1057–1062 (2010)
S. Divinski, M. Lohmann, C. Herzig, Grain boundary diffusion and segregation of Bi in Cu: radiotracer measurements in B and C diffusion regimes. Acta Mater. 52, 3973–3982 (2004)
F.Q. Hu, Q.K. Zhang, J.J. Jiang, Z.L. Song, Influences of Ag addition to Sn–58Bi solder on SnBi/Cu interfacial reaction. Mater. Lett. 214, 142–145 (2018)
Y. Ma, X. Li, L. Yang, W. Zhou, M. Wang, W. Zhu, P. Wu, Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging. Mater. Sci. Eng. A 696, 437–444 (2017)
X. Bi, X. Hu, X. Jiang, Q. Li, Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: first-principles calculations and nano-indentation measurements. Vaccum 164, 7–14 (2019)
W. Yang, H. Yu, J.H. Wang, C.C. Cai, Z.F. Xu, S. Li, F. Liu, G.C. Yang, Application of dendrite fragmentation to fabricate the homogeneous dispersed structure in undercooled Cu–Co immiscible alloy. J. Alloys Compd. 509, 9675–9678 (2011)
X. Bi, X. Hu, Q. Li, Investigations on elastic properties and electronic structures of α-CoSn3 doped with Ni via first-principles calculations and nano-indentation measurements. Results Phys. 15, 102607 (2019)
W. Yang, Z.F. Xu, W.J. Li, C.C. Cai, S. Li, F. Liu, G.C. Yang, Comparisons of grain refinement and recalescence behavior during the rapid solidification of undercooled Cu–Co and Cu–Ni alloys. Phys. B 406, 3710–3714 (2011)
W. Yang, S.H. Chen, H. Yu, S. Li, F. Liu, G.C. Yang, Effects of liquid separation on the microstructure formation and hardness behavior of undercooled Cu–Co alloy. Appl. Phys. A 109, 665–671 (2012)
H. Yu, S.N. Chen, W. Yang, Y.L. Zhang, S.H. Chen, Effects of rare element and pressure on the microstructure and mechanical property of AZ91D alloy. J. Alloys Compd. 589, 479–484 (2014)
W. Yang, F. Liu, H.F. Wang, B.P. Lu, G.C. Yang, Non-equilibrium transformation kinetics and primary grain size distribution in the rapid solidification of Fe-B hypereutectic alloy. J. Alloys Compd. 509, 2903–2908 (2011)
H.F. Zou, Q.K. Zhang, Z.F. Zhang, Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate. J. Mater. Sci. Eng. A. 532, 167–177 (2012)
Y. Qiu, X. Hu, Y. Li, X. Jiang, Influence of Zn additions on the interfacial reaction and microstructure of Sn37Pb/Cu solder joints. Appl. Phys. A 123, 635–648 (2017)
K.H. Prakash, T. Sritharan, Interface reaction between copper and molten tin–lead solders. Acta Mater. 49, 2481–2489 (2001)
M. Yang, Y. Cao, S. Joo, H. Chen, X. Ma, M. Li, Cu6Sn5 precipitation during Sn-based solder/Cu joint solidification and its effects on the growth of interfacial intermetallic compounds. J. Alloys Compd. 582, 688–695 (2014)
X. Hu, T. Xu, X. Jiang, Y. Li, Y. Liu, Z. Min, Effects of post-reflow cooling rate and thermal aging on growth behavior of interfacial intermetallic compound between SAC305 solder and Cu substrate. Appl. Phys. A 122, 278–287 (2016)
H. Nishikawa, J.Y. Piao, T. Takemoto, Interfacial Reaction between Sn–0.7Cu (–Ni) Solder and Cu Substrate. J. Electron. Mater. 35, 1127–1132 (2006)
C.-H. Lin, S.-W. Chen, C.-H. Wang, Phase equilibria and solidification properties of Sn–Cu–Ni alloys. J. Electron. Mater. 31, 907–915 (2002)
S.-W. Chen, S.-H. Wu, S.-W. Lee, Interfacial reactions in the Sn–(Cu)/Ni, Sn–(Ni)/Cu, and Sn/(Cu, Ni) systems. J. Electron. Mater. 32, 1188–1194 (2003)
T. Maeshima, H. Ikehata, K. Terui, Y. Sakamoto, Effect of Ni to the Cu substrate on the interfacial reaction with Sn–Cu solder. Mater. Des. 103, 106–113 (2016)
F. Wang, L. Zhou, X. Wang, P. He, Microstructural evolution and joint strength of Sn–58Bi/Cu joints through minor Zn alloying substrate during isothermal aging. J. Alloys Compd. 688, 639–648 (2016)
M.K. Lee, J.G. Lee, J.K. Lee, S.M. Hong, S.H. Lee, J.J. Park, J.W. Kim, C.K. Rhee, Formation of interfacial brittle phases sigma phase and IMC in hybrid titanium-to-stainless steel joint. Trans. Nonferrous Met. Soc. China 21, 7–11 (2011)
V.I. Dybkov, Growth of chemical compound layers in composite materials. Mater. Lett. 3, 278–281 (1985)
M. McCormack, H.S. Chen, G.W. Kammlott, S. Jin, Significantly improved of Bi-Sn solder alloys mechanical properties by Ag-doping. J. Electron. Mater. 26, 954–958 (1997)
Q.K. Zhang, H.F. Zou, Z.F. Zhang, Improving tensile and fatigue properties of Sn–58Bi/Cu solder joints through alloying substrate. J. Mater. Res. 25, 303–314 (2010)
X. Hu, X. Yu, Y. Li, Q. Huang, Y. Liu, Z. Min, Effect of strain rate on interfacial fracture behaviors of Sn–58Bi/Cu solder joints. J. Mater. Sci. Mater. Electron. 25, 57–64 (2014)
P.B. Thompson, R. Johnson, S.P.V. Nadimpalli, Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints. Eng. Fract. Mech. 199, 730–738 (2018)
W.Y. Li, X.P. Zhang, H.B. Qin, Y.W. Mai, Joule heating dominated fracture behavior change in micro-scale Cu/Sn–3.0Ag–0.5Cu/Cu(Ni) joints under electro-thermal coupled loads. Microelectron. Reliab. 82, 224–227 (2018)
This work was supported by the National Natural Science Foundation of China (No. 51765040), Natural Science Foundation of Jiangxi Province (20192ACB21021), Outstanding Young talents funding of Jiangxi Province (20192BCB23002) and the Innovative Funding for Graduate Students in Nanchang University (No. CX2019065).
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Cheng, J., Hu, X., Li, Q. et al. Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint. Appl. Phys. A 126, 297 (2020). https://doi.org/10.1007/s00339-020-03483-9
- Solder joint
- Ni addition
- Reflow soldering
- IMC layer
- Tensile strength