Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint


In the current investigation, various mass fractions (0, 0.5, 1.5, 5 and 10 wt%) of Ni were doped into Cu substrate, and influences of Ni addition on the microstructure evolution and mechanical property of the Sn–58Bi/Cu–xNi solder joint were investigated. Results showed that the growth rate of intermetallic compound (IMC) would increase with the Ni addition added from 0 to 5 wt% and remarkably decreased for Sn–58Bi/Cu–10Ni joint system. It indicated that the growth rate of IMC layer would decrease when 10 wt% Ni was added into the alloy. Besides, the tensile strength reduced with increase in the IMC thickness, which was under the synergistic effect of increasing liquid-state reaction time and the content of Ni addition (0–5 wt%). Moreover, the fracture mechanism gradually transformed from ductile fracture mode to brittle fracture mode with the decrease in joint strength.

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This work was supported by the National Natural Science Foundation of China (No. 51765040), Natural Science Foundation of Jiangxi Province (20192ACB21021), Outstanding Young talents funding of Jiangxi Province (20192BCB23002) and the Innovative Funding for Graduate Students in Nanchang University (No. CX2019065).

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Cheng, J., Hu, X., Li, Q. et al. Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint. Appl. Phys. A 126, 297 (2020).

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  • Solder joint
  • Ni addition
  • Reflow soldering
  • IMC layer
  • Tensile strength