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High thermal conductivity liquid metal pad for heat dissipation in electronic devices

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Abstract

Novel thermal interface materials using Ag-doped Ga-based liquid metal were proposed for heat dissipation of electronic packaging and precision equipment. On one hand, the viscosity and fluidity of liquid metal was controlled to prevent leakage; on the other hand, the thermal conductivity of the Ga-based liquid metal was increased up to 46 W/mK by incorporating Ag nanoparticles. A series of experiments were performed to evaluate the heat dissipation performance on a CPU of smart-phone. The results demonstrated that the Ag-doped Ga-based liquid metal pad can effectively decrease the CPU temperature and change the heat flow path inside the smart-phone. To understand the heat flow path from CPU to screen through the interface material, heat dissipation mechanism was simulated and discussed.

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Acknowledgements

We appreciate financial support from National Science Foundation of China (Grant No. 11204097 and U1530120).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Sun Yat-sen University, Guangzhou, 510275, People’s Republic of China

    Zuoye Lin, Huiqiang Liu, Qiuguo Li, Han Liu, Sheng Chu & Yuhua Yang

  2. School of Metallurgy and Environment, Central South University, Changsha, 410083, China

    Guang Chu

Authors
  1. Zuoye Lin
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  2. Huiqiang Liu
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  3. Qiuguo Li
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  4. Han Liu
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  5. Sheng Chu
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  7. Guang Chu
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Corresponding author

Correspondence to Sheng Chu.

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Lin, Z., Liu, H., Li, Q. et al. High thermal conductivity liquid metal pad for heat dissipation in electronic devices. Appl. Phys. A 124, 368 (2018). https://doi.org/10.1007/s00339-018-1778-z

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