Abstract
In this paper results for liquid media are presented, which are used the first time as liquid jet for cutting of silicon with laser chemical processing (LCP). The liquids contain a perfluoro-carbon compound as solvent and elemental chlorine as etching agent for silicon. Experiments were performed to investigate its influence on groove form and maximum achieved groove depth. It is shown that with the addition of low-concentration chlorine, the groove depth can already be significantly increased. The groove shape could be changed from a V-profile to a U-profile. Furthermore, an about four times greater groove depth was achieved by applying a saturated chlorine solution compared to groove depths without using chlorine. Finally, a theory is given and discussed to describe the phenomena observed.
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References
B. Richerzhagen, Entwicklung und Konstruktion eines Systems zur Übertragung von Laserenergie für die Laserzahnbehandlung. Département de Microtechnique, École Polytechnique Fédérale de Lausanne, Lausanne (1994)
G.P. Willeke, D. Kray, A new route towards 50 μm thin crystalline silicon wafer solar cells, in Proceedings of the 17th European Photovoltaic Solar Energy Conference, Munich, Germany (2001), pp. 1621–1624
D. Kray, A. Fell, S. Hopman, K. Mayer, G. Willeke, S.W. Glunz, Laser chemical processing (LCP)—a versatile tool for microstructuring applications. Appl. Phys. A 93, 99–103 (2008)
S. Hopman, A. Fell, K. Mayer, C. Fleischmann, K. Drew, D. Kray, F. Granek, Study on laser parameters for silicon solar cells with LCP selective emitters, in Proceedings of the 24th European Photovoltaic Solar Energy Conference, Hamburg, Germany (2009), pp. 1072–1076
A. Rodofili, S. Hopman, A. Fell, K. Mayer, M. Mesec, F. Granek, S.W. Glunz, Characterization of doping via laser chemical processing (LCP), in Proceedings of the 24th European Photovoltaic Solar Energy Conference, Hamburg, Germany (2009), pp. 1727–1731
D. Kray, A. Fell, S. Hopman, K. Mayer, M. Mesec, S.W. Glunz, G.P. Willeke, Progress in laser chemical processing (LCP) for innovative solar cell microstructuring and wafering applications, in Proceedings of the 22nd European Photovoltaic Solar Energy Conference, Milan, Italy (2007), pp. 1227–1230
S. Kluska, A. Rodofili, K. Mayer, C. Fleischmann, F. Granek, S.W. Glunz, Analysis of local boron dopings formed with LCP, in Proceedings of the 25th European Photovoltaic Solar Energy Conference, Valencia, Spain (2010)
S. Hopman, A. Fell, M. Mesec, S. Kluska, C. Fleischmann, F. Granek, S.W. Glunz, Influence of concentration of phosphorus dopant liquid and pulse distance on parameters of LCP selective emitters for silicon solar cells, in Proceedings of the 25th European Photovoltaic Solar Energy Conference, Valencia, Spain (2010)
W. Koch, A.L. Endrös, D. Franke, C. Häßler, J.P. Kalejs, H.J. Möller, Bulk crystal growth and wafering for PV, in Handbook of Photovoltaic Science and Engineering, ed. by A. Luque, S. Hegedus (Wiley, Chichester, 2003), pp. 205–252
P.M. Nasch, N. Cherradi, A. Müller, C. Seifert, B. Geyer, The way to high-efficiency, low cost solar cells through thin wafer slicing by means of wire saw, in 19th European Photovoltaic Solar Energy Conference, Paris, France (2004), pp. 1118–1121
A. Müller, N. Cherradi, P.M. Nasch, The challenge to implement thin wafer potential with wire saw cutting technology, in 3rd World Conference on Photovoltaic Energy Conversion, Osaka, Japan (2003)
S. Hopman, A. Fell, K. Mayer, M. Mesec, A. Rodofili, D. Kray, Comparison of laser chemical processing and LaserMicroJet for structuring and cutting silicon substrates. Appl. Phys. A 95, 857–866 (2009)
A. Fell, K. Mayer, S. Hopman, D. Kray, Potential and limits of chemical enhanced deep cutting of silicon with a coupled laser-liquid jet. J. Appl. Phys. 21(1), 27–31 (2009)
M. Müllenborn, H. Dirac, J.W. Petersen, Silicon nanostructures produced by laser direct etching. Appl. Phys. Lett. B 66(22), 3001–3003 (1995)
D. Bäuerle, Laser Processing and Chemistry, 3rd edn. (Springer, Linz, 2000)
G.A. de Wijs, A.D. Vita, A. Selloni, Mechanism for SiCl2 formation and desorption and the growth of pits in the etching of Si(100) with chlorine. Phys. Rev. Lett. 78, 4877–4880 (1997)
K. Nakayama, C.M. Aldao, J.H. Weaver, Halogen etching of Si(100) — 2×1: dependence on surface concentration. Phys. Rev. B 59, 15893–15901 (1999)
D.L. Flamm, Mechanisms of silicon etching in fluorine- and chlorine-containing plasmas. Pure Appl. Chem. 62(9), 1709–1720 (1990)
E.A. Ogryzlo, D.L. Flamm, D.E. Ibbotson, J.A. Mucha, The etching of doped polycrystalline silicon by molecular chlorine. J. Appl. Phys. 64(11), 6510–6514 (1988)
E.A. Ogryzlo, D.E. Ibbotson, D.L. Flamm, J.A. Mucha, Doping and crystallographic effects in Cl-atom etching of silicon. J. Appl. Phys. 67(6), 3115–3120 (1990)
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Hopman, S., Mayer, K., Fell, A. et al. Laser cutting of silicon with the liquid jet guided laser using a chlorine-containing jet media. Appl. Phys. A 102, 621–627 (2011). https://doi.org/10.1007/s00339-010-6155-5
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DOI: https://doi.org/10.1007/s00339-010-6155-5