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Holz als Roh- und Werkstoff

, Volume 56, Issue 3, pp 154–154 | Cite as

Particleboard I.B. forcast by TMA bending in UF adhesives curing

  • Y. Laigle
  • C. Kamoun
  • A. Pizzi
Brief Original

Keywords

Internal Bond Thermomechanical Analysis Board Density Resin Solid Adhesive Content 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

References

  1. Garcia R, Pizzi A (1998) Cross-linked and entanglement networks in thermomechanical analysis of polycondensation resins, J. Appl. Polymer Sci., in pressGoogle Scholar
  2. Kamoun C, Pizzi A, Garcia R (1998) The effect of humidity on cross-linked and entanglement networking of formaldehyde-based wood adhesives, Holz Roh Werkstoff, in pressGoogle Scholar
  3. Pizzi A (1997) On the correlation of some theoretical and experimental results in polycondensation resins networking, J. Appl. Polymer Sci., 63: 603–614CrossRefGoogle Scholar

Copyright information

© Springer-Verlag 1998

Authors and Affiliations

  • Y. Laigle
    • 1
  • C. Kamoun
    • 1
  • A. Pizzi
    • 1
  1. 1.ENSTIBUniversity of Nancy 1Epinal Cedex 9France

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