Particleboard I.B. forcast by TMA bending in UF adhesives curing
- 57 Downloads
KeywordsInternal Bond Thermomechanical Analysis Board Density Resin Solid Adhesive Content
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.
- Garcia R, Pizzi A (1998) Cross-linked and entanglement networks in thermomechanical analysis of polycondensation resins, J. Appl. Polymer Sci., in pressGoogle Scholar
- Kamoun C, Pizzi A, Garcia R (1998) The effect of humidity on cross-linked and entanglement networking of formaldehyde-based wood adhesives, Holz Roh Werkstoff, in pressGoogle Scholar
© Springer-Verlag 1998