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Soy-substituted liquid phenol formaldehyde binders for flakeboard

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Abstract

The degree to which liquid phenol formaldehyde resin for flakeboard applications can be replaced by soy flour was studied through a design of experiment approach. Up to ten percent substitution could be achieved while substantially maintaining board properties. Higher levels of substitution increased the viscosity of the resin droplet, which reduced resin spread and various strength properties. The loss of strength was most apparent for dense boards where the spreading limitation reduced the relative bonded area.

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Acknowledgements

This project was funded by the United Soybean Board.

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Authors and Affiliations

  1. Department of Chemical Engineering, Auburn University, Auburn, AL, 36849, USA

    William Hand

  2. School of Forestry and Wildlife Sciences, Auburn University, Auburn, AL, 36849, USA

    George Cheng & Brian Via

  3. School of Chemical and Biomolecular Engineering, Georgia Tech, Atlanta, GA, 30332, USA

    Sujit Banerjee

Authors
  1. William Hand
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  2. George Cheng
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  3. Brian Via
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  4. Sujit Banerjee
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Corresponding authors

Correspondence to Brian Via or Sujit Banerjee.

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Hand, W., Cheng, G., Via, B. et al. Soy-substituted liquid phenol formaldehyde binders for flakeboard. Eur. J. Wood Prod. 75, 135–138 (2017). https://doi.org/10.1007/s00107-016-1114-2

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  • DOI: https://doi.org/10.1007/s00107-016-1114-2

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