Advertisement

Computational Mechanics

, Volume 26, Issue 5, pp 470–477 | Cite as

An optimum spacing problem for four chips on a horizontal substrate – mixed convection

  • Y. Liu
  • S. Chen
  • B. W. Shiu

Abstract

 The optimum spacing problem for four heated chips rested on a conductive substrate in a channel is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option for mixed convection situation. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. When the ratio is larger than 1.2, the maximum temperature and the maximum temperature difference can be decreased significantly compared to the ratio of 1.0.

Keywords

Convection Heat Flux Finite Element Method Temperature Difference Thermal Performance 
These keywords were added by machine and not by the authors. This process is experimental and the keywords may be updated as the learning algorithm improves.

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

Copyright information

© Springer-Verlag Berlin Heidelberg 2000

Authors and Affiliations

  • Y. Liu
    • 1
  • S. Chen
    • 1
  • B. W. Shiu
    • 1
  1. 1.Department of Mechanical Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong KongCN

Personalised recommendations