An optimum spacing problem for four chips on a horizontal substrate – mixed convection
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The optimum spacing problem for four heated chips rested on a conductive substrate in a channel is solved by an operator-splitting pseudo-time-stepping finite element method, which automatically satisfies the continuity of the interfacial temperature and heat flux. It is found that the conventional equi-spaced arrangement is not an optimum option for mixed convection situation. An optimum thermal performance can be obtained when the center-to-center distances between the chips follow a geometric series. When the ratio is larger than 1.2, the maximum temperature and the maximum temperature difference can be decreased significantly compared to the ratio of 1.0.
KeywordsConvection Heat Flux Finite Element Method Temperature Difference Thermal Performance
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