Research in Nondestructive Evaluation

, Volume 11, Issue 3, pp 117–135 | Cite as

Ultrasonic Wave Scattering by a Line Crack in a Solder Joint

  • P. Dineva
  • D. Gross
  • T. Rangelov


A numerical procedure for the solution of a wave propagation problem in a solder joint with a line crack in its base layer is presented. The two-dimensional ``in-plane'' wave propagation problem for a finite, multilayered body with a line crack in one of the layers is solved by the combined usage of the displacement and the traction BIEM. The discretization of the boundary with parabolic elements far from the crack edge and with quarter-point crack-tip boundary elements containing the correct \(O(\sqrt{r})\) behavior for displacement variations at the crack edge is used. Numerical results for a solder joint with real geometry and physical properties are presented. The relations between the wave scattering problems, the solder joint fatigue state estimation, and the reliability and quality of electronic packages is discussed.


Solder Joint Print Circuit Board Stress Intensity Factor Crack Edge Line Crack 
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Copyright information

© Springer-Verlag New York Inc. 1999

Authors and Affiliations

  • P. Dineva
    • 1
  • D. Gross
    • 2
  • T. Rangelov
    • 3
  1. 1.Institute of Mechanics, Bulgarian Academy of SciencesSofiaBulgaria
  2. 2.Institute of Mechanics, TH DarmstadtDarmstadtGermany
  3. 3.Institute of Mathematics and Informatics, Bulgarian Academy of SciencesSofiaBulgaria

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